Localization of electrical failures from the backside of the die: Failure Analysis case studies using infrared emission microscope

We demonstrate how the Infrared Emission Microscope was used to localize defects in standard I/O pins of integrated circuits and how emission images were used to verify electrical fail signatures. The paper also discusses a method that can be used to improve the localization of electrical failures.

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Bibliographic Details
Main Authors: Bailon, M.F., Tarun, A.B., Nery, M., Munoz, J.
Format: Conference Proceeding
Language:English
Subjects:
Atomic force microscopy
Circuit faults
Computer aided software engineering
Electron emission
Failure analysis
Integrated circuit interconnections
Optical microscopy
Scanning electron microscopy
Transistors
Transmission electron microscopy
Online Access:Request full text
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Description
Summary:We demonstrate how the Infrared Emission Microscope was used to localize defects in standard I/O pins of integrated circuits and how emission images were used to verify electrical fail signatures. The paper also discusses a method that can be used to improve the localization of electrical failures.
DOI:10.1109/IPFA.2003.1222764