New packaging of a chip on a board by a unique printing method

• Published in: IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1992-02, Vol.15 (1), p.73-77
• Main Authors: Okuno, A., Nagai, K., Ikeda, K., Tsukasaki, Y., Oyama, N., Nakahira, K., Hashimoto, T.
• Format: Article
• Language: English
• Subjects: Applied sciences; Bonding; Design. Technologies. Operation analysis. Testing; Electronics; Electronics packaging; Epoxy resins; Exact sciences and technology; Integrated circuit packaging; Integrated circuits; Large scale integration; Packaging machines; Printing; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Surface-mount technology; Transfer molding; Wire
• ISSN: 0148-6411; 1558-3082
• DOI: 10.1109/33.124194

Transfer molding is a typical method for packaging integrated circuits (ICs). Transfer molding is very difficult to do at heights less than 1 mm, and has a limited surface mounting area. Recent research of high density surface mounting for thinner and lighter weight packaging has progressed for both IC cards and liquid crystal displays (LCDs). However, the dispensing method has many problems, such as the height variations of the coating, difficulties of uniform spreading on large size ICs, and one-by-one encapsulation. A unique printing method is developed to solve such problems. Through this method it is possible to achieve a height less than 1 mm and a uniform thickness on an integrated system. On reaching these parameters, the surface mount ICs replace molded packaged devices that are manufactured using expensive equipment and molding dies. The method requires only a small amount of epoxy resin and is, therefore, more economical than the conventional transfer molding process. A one-component epoxy resin NPR-150 suitable for printing is developed.< >