Active thermal control of power electronics modules

Active thermal control techniques make it feasible to regulate the steady state and transient thermal-mechanical stress in power electronic modules for applications such as motor drives. On-line junction temperature estimation and manipulation of the switching frequency and current limit to regulate...

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Bibliographic Details
Main Authors: Murdock, D.A., Ramos, J.E., Connors, J.J., Lorenz, R.D.
Format: Conference Proceeding
Language:English
Subjects:
Frequency estimation
Insulated gate bipolar transistors
Motor drives
Multichip modules
Power electronics
Steady-state
Stress control
Switching frequency
Temperature
Thermal stresses
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Summary:Active thermal control techniques make it feasible to regulate the steady state and transient thermal-mechanical stress in power electronic modules for applications such as motor drives. On-line junction temperature estimation and manipulation of the switching frequency and current limit to regulate the losses, are used to prevent over-temperature and power cycling failures in IGBT power modules. The techniques developed in this work are used to actively control the junction temperature of the power module. This control strategy improves power module reliability and increases utilization of the silicon thermal capacity by providing sustained operation at maximum attainable performance limits.
DOI:10.1109/IAS.2003.1257756