Electrical test strategies for a wafer-level packaging technology

A wafer-level packaging (WLP) technology is under development that provides compliant electrical leads with a density as high as 12,000 per cm/sup 2/. The leads are batch processed while the integrated circuits are still in wafer form through a series of relatively simple photolithographic steps. Af...

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Bibliographic Details
Published in:IEEE transactions on electronics packaging manufacturing 2003-10, Vol.26 (4), p.267-272
Main Authors: Keezer, D.C., Patel, C.S., Bakir, M.S., Qing Zhou, Meindl, J.D.
Format: Article
Language:English
Subjects:
Applied sciences
Assembly
Bonding
Circuit testing
Contacts
Costs
Density
Design. Technologies. Operation analysis. Testing
Electric potential
Electronics
Exact sciences and technology
Fabrication
Integrated circuit packaging
Integrated circuit technology
Integrated circuits
Interfaces
Lead
Microelectronic fabrication (materials and surfaces technology)
Packaging
Photolithography
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Strategy
Wafer scale integration
Wafers
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Description
Summary:A wafer-level packaging (WLP) technology is under development that provides compliant electrical leads with a density as high as 12,000 per cm/sup 2/. The leads are batch processed while the integrated circuits are still in wafer form through a series of relatively simple photolithographic steps. After electrical testing, the wafers are diced and the integrated circuits (ICs) are ready for direct assembly to an interconnect substrate. Sufficient lateral and vertical compliance is provided by the leads to accommodate the nonplanarity encountered during assembly and the thermal mismatch between the IC and substrate during normal operation. The high density of compliant leads presents both challenges and opportunities for electrical testing. This paper first summarizes the process technology used to fabricate these high-density electrical contacts. Several potential test strategies are then introduced that may take advantage of these contacts.
ISSN:1521-334X
1558-0822
DOI:10.1109/TEPM.2003.822063