A 65nm node strained SOI technology with slim spacer

• Main Authors: Fu-Liang Yang, Chien-Chao Huang, Hou-Yu Chen, Jhon-Jhy Liaw, Tang-Xuan Chung, Hung-Wei Chen, Chang-Yun Chang, Cheng Chuan Huang, Kuang-Hsin Chen, Di-Hong Lee, Hsun-Chih Tsao, Cheng-Kuo Wen, Shui-Ming Cheng, Yi-Ming Sheu, Ke-Wei Su, Chi-Chun Chen, Tze-Liang Lee, Shih-Chang Chen, Chih-Jian Chen, Cheng-hung Chang, Jhi-cheng Lu, Weng Chang, Chuan-Ping Hou, Ying-Ho Chen, Kuei-Shun Chen, Ming Lu, Li-Wei Kung, Yu-Jun Chou, Fu-Jye Liang, Jan-Wen You, King-Chang Shu, Bin-Chang Chang, Jaw-Jung Shin, Chun-Kuang Chen, Tsai-Sheng Gau, Bor-Wen Chan, Yi-Chun Huang, Han-Jan Tao, Jyh-Huei Chen, Yung-Shun Chen, Yee-Chia Yeo, Fung, S.K.-H., Diaz, C.H., Wu, C.-M.M., Lin, B.J., Liang, M.-S., Sun, J.Y.-C., Chenming Hu
• Format: Conference Proceeding
• Language: English
• Subjects: Capacitive sensors; Circuits; CMOS technology; FinFETs; Immune system; Inverters; Solid modeling; Space technology; Stress; Transistors
• DOI: 10.1109/IEDM.2003.1269359

A 65 nm node strained SOI technology with high performance is demonstrated, providing drive currents of 1015 and 500 /spl mu/A//spl mu/m for N-FET and P-FET, respectively, at an off-state leakage of 40 nA//spl mu/m using 1 V operation. The technology employs an aggressively scaled slim spacer of 30 nm width to amplify stress benefits for performance improvement, and to reduce by 10-20 % the layout area for SRAM-cell-like circuits, while maintaining excellent hot carrier immunity and well-controlled short-channel effects. For the first time, we demonstrate that FinFET devices, implicitly implemented in this technology, offer a 8-15 % higher inverter speed compared to planar SOI devices at the same drive current.