Development of a dynamic test board for FCBGA solder joint reliability assessment in shock & vibration

A dynamic test board (DTB) is developed for shock and vibration (S&V) test. The test board is used to characterize the solder joint reliability (SJR) of the component corresponding to the specified dynamic test requirements. The dynamic behaviour and properties are investigated in the developmen...

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Main Authors: Tze Yang Hin, Keh Shin Beh, Seetharamu, K.N.
Format: Conference Proceeding
Language:English
Subjects:
Capacitive sensors
Electric shock
Electronics packaging
Fingers
Heat sinks
Life estimation
Packaging machines
Soldering
System testing
Vibrations
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Keh Shin Beh
Seetharamu, K.N.
description A dynamic test board (DTB) is developed for shock and vibration (S&V) test. The test board is used to characterize the solder joint reliability (SJR) of the component corresponding to the specified dynamic test requirements. The dynamic behaviour and properties are investigated in the development of a flip chip ball grid array package (FCBGA). The BGA tested have 1.27, 1.09 and 1.00 mm ball pitches respectively. One of the significant findings is that board strain is correlated with the solder joint failing location. Hence, this paper introduces board strain as a predictor for S&V SJR risk and component strain limit definition in S&V conditions.
doi_str_mv 10.1109/EPTC.2003.1271525
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Capacitive sensors
Electric shock
Electronics packaging
Fingers
Heat sinks
Life estimation
Packaging machines
Soldering
System testing
Vibrations
title Development of a dynamic test board for FCBGA solder joint reliability assessment in shock & vibration
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