Comparative study on solder joint reliability using different FE-models

Two finite-element-analysis (FEA) models, 3D-slice model and 1/8 or octant model, were used to simulate the solder joint reliability of ball grid array (BGA) packages. The solders were treated as Anand's viscoplastic material and their fatigue life was estimated by Darveaux's model. Simula...

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Bibliographic Details
Main Authors: Zhu, W.H., Stoeckl, S., Pape, H., Gan, S.L.
Format: Conference Proceeding
Language:English
Subjects:
Analytical models
Electronics packaging
Fatigue
Field emitter arrays
Finite element methods
Life estimation
Resists
Soldering
Temperature
Testing
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Summary:Two finite-element-analysis (FEA) models, 3D-slice model and 1/8 or octant model, were used to simulate the solder joint reliability of ball grid array (BGA) packages. The solders were treated as Anand's viscoplastic material and their fatigue life was estimated by Darveaux's model. Simulation results are compared with some Weibull analysis results of the temperature cycling on board (TCOB) tests. It is confirmed that a big solder resist opening (SRO) and soft solder resist material greatly improves the fatigue life of solder joints. A good correlation of the first failure location between testing and simulation was found by cross-sectioning. Mostly the corner ball in the center matrix failed first. Besides, effects of voids in the solder balls are also discussed and analyzed.
DOI:10.1109/EPTC.2003.1271607