Stacked BGA design, development, and materials selection considerations for improved testing and stacking, reduced warpage and environmental stress, and enhanced thermal qualities

A stackable ball grid array (BGA) or fine-pitch ball grid array (FBGA) semiconductor package is particularly suitable for board-on-chip or chip-on-board applications in which a low-profile BGA or FBGA semiconductor package is needed. It enables the doubling of a memory module's capacity by stac...

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Bibliographic Details
Main Authors: Tan Yong Kian, Tay Wuu Yean, Lee Kian Chai, Ng Hong Wan
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Circuit testing
Costs
Decoding
Electronics packaging
Materials testing
Semiconductor device packaging
Semiconductor device testing
Stacking
Thermal stresses
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Description
Summary:A stackable ball grid array (BGA) or fine-pitch ball grid array (FBGA) semiconductor package is particularly suitable for board-on-chip or chip-on-board applications in which a low-profile BGA or FBGA semiconductor package is needed. It enables the doubling of a memory module's capacity by stacking an additional device on top of the original device. However, due to the high tooling costs of dedicated BGA/FBGA semiconductor package test kits and burn-in boards, many memory suppliers only pursue a stacked TSOP solution that requires no new tooling during the assembly and testing of the TSOP singles. This paper discusses the various considerations and approaches of designing a stackable BGA or FBGA semiconductor package capable of being burned in and tested using a more efficient and cost-effective method than previously available for BGA and FBGA packages.
DOI:10.1109/EPTC.2003.1271621