EER architecture specifications for OFDM transmitter using a class E amplifier

This letter presents envelope elimination and restoration (EER) architecture specifications in the case of orthogonal frequency division multiplex C band transmission. A key point is the recombination of envelope and phase information by supply modulation of the power amplifier (PA). Imperfections,...

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Bibliographic Details
Published in:IEEE microwave and wireless components letters 2004-08, Vol.14 (8), p.389-391
Main Authors: Diet, A., Berland, C., Villegas, M., Baudoin, G.
Format: Article
Language:English
Subjects:
Amplifiers
Applied sciences
Architecture
Circuit properties
Electric, optical and optoelectronic circuits
Electronic circuits
Electronics
Engineering Sciences
Envelopes
Exact sciences and technology
Frequency division multiplexing
Measurement standards
MESFETs
Modulation
OFDM modulation
Orthogonal Frequency Division Multiplexing
Peak to average power ratio
Phase modulation
Phase noise
Power amplifiers
Radiocommunications
Restoration
Signal and Image processing
Signal restoration
Specifications
Telecommunications
Telecommunications and information theory
Transmitters
Transmitters. Receivers
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Summary:This letter presents envelope elimination and restoration (EER) architecture specifications in the case of orthogonal frequency division multiplex C band transmission. A key point is the recombination of envelope and phase information by supply modulation of the power amplifier (PA). Imperfections, such as time mismatch and phase noise can reduce the performances of the transmission. Compression and conversion effects when supply modulating the PA are introduced in this letter with the simulation of a class E power amplifier. This amplifier was designed under HP-ADS using a nonlinear MESFET model. Results are reported in terms of error vector measurement and spectrum for two different numbers of sub-carriers 32 and 128 in 16-QAM and 64-QAM cases.
ISSN:1531-1309
2771-957X
1558-1764
2771-9588
DOI:10.1109/LMWC.2004.832618