MEMS SiGe technologies for advanced wireless communications

This paper shows the potentialities of merging MEMS and micromachining with SiGe technologies in order to speed up the performance of the next generation of front ends, in term of flexibility, reconfigurability and adaptability. MEMS technologies are presented, based on BCB materials and BAW materia...

Full description

Saved in:
Bibliographic Details
Main Authors: Busquere, J.P., Do, N., Bougriha, F., Pons, P., Grenier, K., Dubuc, D., Boukabache, A., Schumacher, H., Abele, P., Rydberg, A., Ojefors, E., Ancey, P., Bouche, G., Plana, R.
Format: Conference Proceeding
Language:English
Subjects:
Acoustic wave devices, piezoelectric and piezoresistive devices
Applied sciences
Electronics
Exact sciences and technology
Germanium silicon alloys
Hardware
Heterojunction bipolar transistors
Input-output equipment
Integrated circuit technology
Materials science and technology
Micro- and nanoelectromechanical devices (mems/nems)
Microelectronic fabrication (materials and surfaces technology)
Micromachining
Micromechanical devices
Radio frequency
Radiofrequency integrated circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Silicon germanium
Wireless communication
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This paper shows the potentialities of merging MEMS and micromachining with SiGe technologies in order to speed up the performance of the next generation of front ends, in term of flexibility, reconfigurability and adaptability. MEMS technologies are presented, based on BCB materials and BAW materials. Special attention is paid to ensure full compatibility between IC and MEMS. We have shown that very innovative functions could be considered by using this MEMSIC concept.
ISSN:1529-2517
2375-0995
DOI:10.1109/RFIC.2004.1320586