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A diplexer-matching dual-band power amplifier LTCC module for IEEE 802.11a/b/g wireless LANs
We have developed a compact dual-band (2.4/5 GHz) power-amplifier module with a concurrent two-stage InGaP/GaAs HBT for triple-mode (IEEE 802.11a/b/g) WLANs. The proposed diplexer-matching network is three-dimensionally implemented in an LTCC substrate (5/spl times/5 mm). The module exhibits an outp...
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creator | Kunihiro, K. Yamanouchi, S. Miyazaki, T. Aoki, Y. Ikuina, K. Ohtsuka, T. Hida, H. |
description | We have developed a compact dual-band (2.4/5 GHz) power-amplifier module with a concurrent two-stage InGaP/GaAs HBT for triple-mode (IEEE 802.11a/b/g) WLANs. The proposed diplexer-matching network is three-dimensionally implemented in an LTCC substrate (5/spl times/5 mm). The module exhibits an output power of 20 dBm at 2.4 GHz, and 18 dBm at 5.25 GHz with an error vector magnitude of 4-5% for a 54-Mbps OFDM signal. Our approach of using a concurrent dual-band PA reduces the size and cost by almost half compared with using a conventional parallel PA. |
doi_str_mv | 10.1109/RFIC.2004.1320603 |
format | conference_proceeding |
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The proposed diplexer-matching network is three-dimensionally implemented in an LTCC substrate (5/spl times/5 mm). The module exhibits an output power of 20 dBm at 2.4 GHz, and 18 dBm at 5.25 GHz with an error vector magnitude of 4-5% for a 54-Mbps OFDM signal. Our approach of using a concurrent dual-band PA reduces the size and cost by almost half compared with using a conventional parallel PA.</description><identifier>ISSN: 1529-2517</identifier><identifier>ISBN: 9780780383333</identifier><identifier>ISBN: 0780383338</identifier><identifier>EISSN: 2375-0995</identifier><identifier>DOI: 10.1109/RFIC.2004.1320603</identifier><language>eng</language><publisher>Piscataway NJ: IEEE</publisher><subject>Amplifiers ; Applied sciences ; Circuit properties ; Costs ; Dual band ; Electric, optical and optoelectronic circuits ; Electrical engineering. Electrical power engineering ; Electronic circuits ; Electronic equipment and fabrication. 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Digest of Papers</title><addtitle>RFIC</addtitle><description>We have developed a compact dual-band (2.4/5 GHz) power-amplifier module with a concurrent two-stage InGaP/GaAs HBT for triple-mode (IEEE 802.11a/b/g) WLANs. The proposed diplexer-matching network is three-dimensionally implemented in an LTCC substrate (5/spl times/5 mm). The module exhibits an output power of 20 dBm at 2.4 GHz, and 18 dBm at 5.25 GHz with an error vector magnitude of 4-5% for a 54-Mbps OFDM signal. Our approach of using a concurrent dual-band PA reduces the size and cost by almost half compared with using a conventional parallel PA.</description><subject>Amplifiers</subject><subject>Applied sciences</subject><subject>Circuit properties</subject><subject>Costs</subject><subject>Dual band</subject><subject>Electric, optical and optoelectronic circuits</subject><subject>Electrical engineering. Electrical power engineering</subject><subject>Electronic circuits</subject><subject>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Impedance matching</subject><subject>Local area networks</subject><subject>Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits</subject><subject>National electric code</subject><subject>OFDM</subject><subject>Power amplifiers</subject><subject>Power electronics, power supplies</subject><subject>Power generation</subject><subject>Radiofrequency amplifiers</subject><subject>Wireless LAN</subject><issn>1529-2517</issn><issn>2375-0995</issn><isbn>9780780383333</isbn><isbn>0780383338</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2004</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNpFUF1LwzAUDX6Ac-4HiC958TFdctM2yeMonQ6Kgsw3YaTpzYy0W2k2pv_ewgQvB86BczgcLiH3gidCcDN_W66KBDhPEyGB51xekAlIlTFuTHZJZkZpPkJqOd4VmYgMDINMqBtyG-MX51yJ3EzIx4I2oW_xGwfW2YP7DLstbY62ZbXdNbTfn3Cgtuvb4MOoqnVR0G7fHFukfj_QVVmWVHMYR9l5Pd_SUxiwxRhptXiJd-Ta2zbi7I-n5H1ZrotnVr0-rYpFxYLQ6YGhVDXK3FmDDdgUpUCVctDgHDSyNrVuZJ6nRnvvaqWkS5W1mUfItIAcazklj-fe3kZnWz_YnQtx0w-hs8PPRqgMcgAx5h7OuYCI__b5gfIXggZf1A</recordid><startdate>2004</startdate><enddate>2004</enddate><creator>Kunihiro, K.</creator><creator>Yamanouchi, S.</creator><creator>Miyazaki, T.</creator><creator>Aoki, Y.</creator><creator>Ikuina, K.</creator><creator>Ohtsuka, T.</creator><creator>Hida, H.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope><scope>IQODW</scope></search><sort><creationdate>2004</creationdate><title>A diplexer-matching dual-band power amplifier LTCC module for IEEE 802.11a/b/g wireless LANs</title><author>Kunihiro, K. ; Yamanouchi, S. ; Miyazaki, T. ; Aoki, Y. ; Ikuina, K. ; Ohtsuka, T. ; Hida, H.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i184t-e37be36ca9ed2a4e31e740282cc2d3b9b8d366498ffcb773c47aa5fe258126eb3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Amplifiers</topic><topic>Applied sciences</topic><topic>Circuit properties</topic><topic>Costs</topic><topic>Dual band</topic><topic>Electric, optical and optoelectronic circuits</topic><topic>Electrical engineering. Electrical power engineering</topic><topic>Electronic circuits</topic><topic>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Impedance matching</topic><topic>Local area networks</topic><topic>Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits</topic><topic>National electric code</topic><topic>OFDM</topic><topic>Power amplifiers</topic><topic>Power electronics, power supplies</topic><topic>Power generation</topic><topic>Radiofrequency amplifiers</topic><topic>Wireless LAN</topic><toplevel>online_resources</toplevel><creatorcontrib>Kunihiro, K.</creatorcontrib><creatorcontrib>Yamanouchi, S.</creatorcontrib><creatorcontrib>Miyazaki, T.</creatorcontrib><creatorcontrib>Aoki, Y.</creatorcontrib><creatorcontrib>Ikuina, K.</creatorcontrib><creatorcontrib>Ohtsuka, T.</creatorcontrib><creatorcontrib>Hida, H.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE/IET Electronic Library</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection><collection>Pascal-Francis</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kunihiro, K.</au><au>Yamanouchi, S.</au><au>Miyazaki, T.</au><au>Aoki, Y.</au><au>Ikuina, K.</au><au>Ohtsuka, T.</au><au>Hida, H.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>A diplexer-matching dual-band power amplifier LTCC module for IEEE 802.11a/b/g wireless LANs</atitle><btitle>2004 IEE Radio Frequency Integrated Circuits (RFIC) Systems. Digest of Papers</btitle><stitle>RFIC</stitle><date>2004</date><risdate>2004</risdate><spage>303</spage><epage>306</epage><pages>303-306</pages><issn>1529-2517</issn><eissn>2375-0995</eissn><isbn>9780780383333</isbn><isbn>0780383338</isbn><abstract>We have developed a compact dual-band (2.4/5 GHz) power-amplifier module with a concurrent two-stage InGaP/GaAs HBT for triple-mode (IEEE 802.11a/b/g) WLANs. The proposed diplexer-matching network is three-dimensionally implemented in an LTCC substrate (5/spl times/5 mm). The module exhibits an output power of 20 dBm at 2.4 GHz, and 18 dBm at 5.25 GHz with an error vector magnitude of 4-5% for a 54-Mbps OFDM signal. Our approach of using a concurrent dual-band PA reduces the size and cost by almost half compared with using a conventional parallel PA.</abstract><cop>Piscataway NJ</cop><pub>IEEE</pub><doi>10.1109/RFIC.2004.1320603</doi><tpages>4</tpages></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | ISSN: 1529-2517 |
ispartof | 2004 IEE Radio Frequency Integrated Circuits (RFIC) Systems. Digest of Papers, 2004, p.303-306 |
issn | 1529-2517 2375-0995 |
language | eng |
recordid | cdi_ieee_primary_1320603 |
source | IEEE Xplore All Conference Series |
subjects | Amplifiers Applied sciences Circuit properties Costs Dual band Electric, optical and optoelectronic circuits Electrical engineering. Electrical power engineering Electronic circuits Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Impedance matching Local area networks Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits National electric code OFDM Power amplifiers Power electronics, power supplies Power generation Radiofrequency amplifiers Wireless LAN |
title | A diplexer-matching dual-band power amplifier LTCC module for IEEE 802.11a/b/g wireless LANs |
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