Integration of SAW RF Rx filter stacked on a transceiver chip in a QFN package

• Main Authors: Jones, R.E., Ramiah, C., Kamgaing, T., Banerjee, S.K., Chi-Taou Tsai, Hughes, H., De Silva, A., Drye, J., Vaughan, C., Miglore, R., Penunuri, D., Lucero, R., Frear, D.R., Miller, M.
• Format: Conference Proceeding
• Language: English
• Subjects: Acoustic wave devices, piezoelectric and piezoresistive devices; Applied sciences; Circuit properties; Costs; Design. Technologies. Operation analysis. Testing; Distributed control; Electric, optical and optoelectronic circuits; Electronic circuits; Electronics; Exact sciences and technology; Frequency filters; Integrated circuits; Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits; Mobile handsets; Radio frequency; SAW filters; Semiconductor device modeling; Semiconductor device packaging; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Substrates; Surface acoustic waves; Transceivers
• ISSN: 1529-2517; 2375-0995
• DOI: 10.1109/RFIC.2004.1320604

Enhanced integration of mobile phone components is driven by demands for reduced form factor and cost. Because SAW filters must be fabricated on piezoelectric substrates, they are difficult to monolithically integrate on semiconductor chips. Here we report on the integration of a compact wafer-scale packaged SAW filter stacked over a transceiver chip in a quad flat-pack no-lead (QFN) package. An integrated passive device interposer provided redistribution and matching. We demonstrated the successful integration of both EGSM and DCS filters in such modules. SAW compact models based on the coupling of modes model were developed to facilitate system design.