Resistance monitoring vehicle for advanced copper process technology

This paper describes the design, testing and failure analysis results of a test chip especially designed to detect resistive contacts, vias and metal lines in advanced copper technologies. Cumulative distribution plots of the measured resistance and FIB cross-section pictures of the defective contac...

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Bibliographic Details
Main Authors: de Jong, J.L., Hsueh, I.-C.E., Nguyen, L.L., Nguyen, T., Gitlin, D.
Format: Conference Proceeding
Language:English
Subjects:
Applied sciences
Circuit testing
Condition monitoring
Contact resistance
Copper
Current measurement
Design. Technologies. Operation analysis. Testing
Electrical resistance measurement
Electronics
Exact sciences and technology
Failure analysis
Integrated circuits
Intelligent vehicles
Logic testing
Semiconductor device measurement
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Testing, measurement, noise and reliability
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Description
Summary:This paper describes the design, testing and failure analysis results of a test chip especially designed to detect resistive contacts, vias and metal lines in advanced copper technologies. Cumulative distribution plots of the measured resistance and FIB cross-section pictures of the defective contacts and vias found in 90 nm and 130 nm processes are shown.
DOI:10.1109/IPFA.2004.1345531