Analytical investigation of flat silicon micro heat spreaders

Conventional methods of cooling are not an ideal way to overcome the heat problem in power electronics today. A simple solution would be using micro heat spreader as an integrated part in the silicon substrate. This investigation presents a detailed analysis on maximum heat transfer capabilities of...

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Bibliographic Details
Main Authors: Tzanova, S., Ivanova, M., Avenas, Y., Schaeffer, Ch
Format: Conference Proceeding
Language:English
Subjects:
Applied sciences
Conducting materials
Electrical engineering. Electrical power engineering
Electronics cooling
Exact sciences and technology
Heat sinks
Heat transfer
Microelectronics
Microprocessors
Power electronics
Power electronics, power supplies
Predictive models
Silicon
Transistors
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Summary:Conventional methods of cooling are not an ideal way to overcome the heat problem in power electronics today. A simple solution would be using micro heat spreader as an integrated part in the silicon substrate. This investigation presents a detailed analysis on maximum heat transfer capabilities of silicon-water cooling devices, flat plate micro heat spreaders. The predictive hydraulic and thermal models were developed to define the heat spreader thermal performances and capillary limitations. Theoretical results of the maximal heat flux that could be transferred agreed reasonably well with the experimental data and the developed model provides a better understanding of the heat transfer capability of micro heat spreaders.
ISSN:0197-2618
2576-702X
DOI:10.1109/IAS.2004.1348795