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Analytical investigation of flat silicon micro heat spreaders
Conventional methods of cooling are not an ideal way to overcome the heat problem in power electronics today. A simple solution would be using micro heat spreader as an integrated part in the silicon substrate. This investigation presents a detailed analysis on maximum heat transfer capabilities of...
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| container_end_page | 2302 vol.4 |
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| container_start_page | 2296 |
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| creator | Tzanova, S. Ivanova, M. Avenas, Y. Schaeffer, Ch |
| description | Conventional methods of cooling are not an ideal way to overcome the heat problem in power electronics today. A simple solution would be using micro heat spreader as an integrated part in the silicon substrate. This investigation presents a detailed analysis on maximum heat transfer capabilities of silicon-water cooling devices, flat plate micro heat spreaders. The predictive hydraulic and thermal models were developed to define the heat spreader thermal performances and capillary limitations. Theoretical results of the maximal heat flux that could be transferred agreed reasonably well with the experimental data and the developed model provides a better understanding of the heat transfer capability of micro heat spreaders. |
| doi_str_mv | 10.1109/IAS.2004.1348795 |
| format | conference_proceeding |
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A simple solution would be using micro heat spreader as an integrated part in the silicon substrate. This investigation presents a detailed analysis on maximum heat transfer capabilities of silicon-water cooling devices, flat plate micro heat spreaders. The predictive hydraulic and thermal models were developed to define the heat spreader thermal performances and capillary limitations. Theoretical results of the maximal heat flux that could be transferred agreed reasonably well with the experimental data and the developed model provides a better understanding of the heat transfer capability of micro heat spreaders.</description><identifier>ISSN: 0197-2618</identifier><identifier>ISBN: 0780384865</identifier><identifier>ISBN: 9780780384866</identifier><identifier>EISSN: 2576-702X</identifier><identifier>DOI: 10.1109/IAS.2004.1348795</identifier><language>eng</language><publisher>Piscataway NJ: IEEE</publisher><subject>Applied sciences ; Conducting materials ; Electrical engineering. 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A simple solution would be using micro heat spreader as an integrated part in the silicon substrate. This investigation presents a detailed analysis on maximum heat transfer capabilities of silicon-water cooling devices, flat plate micro heat spreaders. The predictive hydraulic and thermal models were developed to define the heat spreader thermal performances and capillary limitations. Theoretical results of the maximal heat flux that could be transferred agreed reasonably well with the experimental data and the developed model provides a better understanding of the heat transfer capability of micro heat spreaders.</description><subject>Applied sciences</subject><subject>Conducting materials</subject><subject>Electrical engineering. Electrical power engineering</subject><subject>Electronics cooling</subject><subject>Exact sciences and technology</subject><subject>Heat sinks</subject><subject>Heat transfer</subject><subject>Microelectronics</subject><subject>Microprocessors</subject><subject>Power electronics</subject><subject>Power electronics, power supplies</subject><subject>Predictive models</subject><subject>Silicon</subject><subject>Transistors</subject><issn>0197-2618</issn><issn>2576-702X</issn><isbn>0780384865</isbn><isbn>9780780384866</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2004</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNpFUMtKw0AUHXyAtXYvuMnGZeqdO88sXJRStVBwoYK7cjMPHUnTkglC_95IBO_mcB4cDpexaw5zzqG6Wy9e5ggg51xIayp1wiaojC4N4PspuwRjQVhptTpjE-CVKVFze8FmOX_BcFJJrvWE3S9aao59ctQUqf0OuU8f1Kd9W-xjERvqi5ya5Aa-S67bF5_hVzp0gXzo8hU7j9TkMPvDKXt7WL0un8rN8-N6udiUiSP0pVcBLZBDL9A4Lz06rA1EECiQe27Ra6Fqb6P11jkRFdbkDUaM5AIJMWW3Y--B8rA0dtS6lLeHLu2oO265kRYqrofczZhLIYR_e_yQ-AH8AlgD</recordid><startdate>2004</startdate><enddate>2004</enddate><creator>Tzanova, S.</creator><creator>Ivanova, M.</creator><creator>Avenas, Y.</creator><creator>Schaeffer, Ch</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope><scope>IQODW</scope></search><sort><creationdate>2004</creationdate><title>Analytical investigation of flat silicon micro heat spreaders</title><author>Tzanova, S. ; Ivanova, M. ; Avenas, Y. ; Schaeffer, Ch</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i120t-d5e280ac2d327cd4d2c2b70f032321d182d635bd8f8d8cc3f52bad72f2facea33</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Applied sciences</topic><topic>Conducting materials</topic><topic>Electrical engineering. Electrical power engineering</topic><topic>Electronics cooling</topic><topic>Exact sciences and technology</topic><topic>Heat sinks</topic><topic>Heat transfer</topic><topic>Microelectronics</topic><topic>Microprocessors</topic><topic>Power electronics</topic><topic>Power electronics, power supplies</topic><topic>Predictive models</topic><topic>Silicon</topic><topic>Transistors</topic><toplevel>online_resources</toplevel><creatorcontrib>Tzanova, S.</creatorcontrib><creatorcontrib>Ivanova, M.</creatorcontrib><creatorcontrib>Avenas, Y.</creatorcontrib><creatorcontrib>Schaeffer, Ch</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection><collection>Pascal-Francis</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tzanova, S.</au><au>Ivanova, M.</au><au>Avenas, Y.</au><au>Schaeffer, Ch</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Analytical investigation of flat silicon micro heat spreaders</atitle><btitle>Conference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting</btitle><stitle>IAS</stitle><date>2004</date><risdate>2004</risdate><volume>4</volume><spage>2296</spage><epage>2302 vol.4</epage><pages>2296-2302 vol.4</pages><issn>0197-2618</issn><eissn>2576-702X</eissn><isbn>0780384865</isbn><isbn>9780780384866</isbn><abstract>Conventional methods of cooling are not an ideal way to overcome the heat problem in power electronics today. A simple solution would be using micro heat spreader as an integrated part in the silicon substrate. This investigation presents a detailed analysis on maximum heat transfer capabilities of silicon-water cooling devices, flat plate micro heat spreaders. The predictive hydraulic and thermal models were developed to define the heat spreader thermal performances and capillary limitations. Theoretical results of the maximal heat flux that could be transferred agreed reasonably well with the experimental data and the developed model provides a better understanding of the heat transfer capability of micro heat spreaders.</abstract><cop>Piscataway NJ</cop><pub>IEEE</pub><doi>10.1109/IAS.2004.1348795</doi><tpages>7</tpages></addata></record> |
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| identifier | ISSN: 0197-2618 |
| ispartof | Conference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting, 2004, Vol.4, p.2296-2302 vol.4 |
| issn | 0197-2618 2576-702X |
| language | eng |
| recordid | cdi_ieee_primary_1348795 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Applied sciences Conducting materials Electrical engineering. Electrical power engineering Electronics cooling Exact sciences and technology Heat sinks Heat transfer Microelectronics Microprocessors Power electronics Power electronics, power supplies Predictive models Silicon Transistors |
| title | Analytical investigation of flat silicon micro heat spreaders |
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