Computer-aided engineering (CAE) applications in semiconductor device manufacturing and reliability

With the ever increasing complexity of semiconductor device designs, the need for designed-in manufacturability and reliability continues to present a challenge for successful semiconductor product introduction. Technology computer-aided design (TCAD) software tools provide the needed device physics...

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Bibliographic Details
Main Authors: Groothuis, S., Meade, R.
Format: Conference Proceeding
Language:English
Subjects:
Application software
Computational modeling
Computer aided engineering
Computer aided manufacturing
Computer applications
Physics
Reliability engineering
Semiconductor device manufacture
Semiconductor device reliability
Semiconductor devices
Online Access:Request full text
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Description
Summary:With the ever increasing complexity of semiconductor device designs, the need for designed-in manufacturability and reliability continues to present a challenge for successful semiconductor product introduction. Technology computer-aided design (TCAD) software tools provide the needed device physics simulations for both functional and performance requirements. However, an innovative approach of using both TCAD tools and computer-aided engineering (CAE) simulation tools (e.g., used in other areas of physics and mechanical engineering) can provide a comprehensive solution to wafer fabrication and device reliability efforts
ISSN:1947-3834
1947-3842
DOI:10.1109/WMED.2005.1431614