Foreword Special Issue of Components and Packaging Technologies With Contributions From ITherm 2004 Thermal Management Track

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Bibliographic Details
Published in:IEEE transactions on components and packaging technologies 2005-06, Vol.28 (2), p.179-181
Main Authors: Ramakrishna, K., Sammakia, B.G., Culham, J.R., Joshi, Y.K.
Format: Article
Language:English
Subjects:
Electronic packaging thermal management
Heat sinks
Heat transfer
Phase change materials
Predictive models
Speech
Technology management
Thermal management
Thermal management of electronics
Thermal resistance
Online Access:Get full text
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ISSN:1521-3331
1557-9972
DOI:10.1109/TCAPT.2005.848625