Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages

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Bibliographic Details
Main Authors: Chong, D.Y.R., Kellin Ng, Tan, J.Y.N., Low, P.T.H., Pang, J.H.L., Che, F.X., Xiong, B.S., Xu, L.H.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Circuit testing
Electronics packaging
Environmentally friendly manufacturing techniques
Integrated circuit packaging
Integrated circuit testing
Intermetallic
Lead
Soldering
Surface finishing
Online Access:Request full text
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ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2005.1441334