Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages

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Main Authors: Chong, D.Y.R., Kellin Ng, Tan, J.Y.N., Low, P.T.H., Pang, J.H.L., Che, F.X., Xiong, B.S., Xu, L.H.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Circuit testing
Electronics packaging
Environmentally friendly manufacturing techniques
Integrated circuit packaging
Integrated circuit testing
Intermetallic
Lead
Soldering
Surface finishing
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creator Chong, D.Y.R.
Kellin Ng
Tan, J.Y.N.
Low, P.T.H.
Pang, J.H.L.
Che, F.X.
Xiong, B.S.
Xu, L.H.
description
doi_str_mv 10.1109/ECTC.2005.1441334
format conference_proceeding
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ispartof Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.622-629
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2377-5726
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recordid cdi_ieee_primary_1441334
source IEEE Xplore All Conference Series
subjects Assembly
Circuit testing
Electronics packaging
Environmentally friendly manufacturing techniques
Integrated circuit packaging
Integrated circuit testing
Intermetallic
Lead
Soldering
Surface finishing
title Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages
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