Solder-Free Pressure Contact Micro-Springs in High-Density Flip-Chip Packages

This work investigates electrical pressure contacts based on a micro-spring with orders of magnitude smaller pitch and force than conventional pressure contacts. Flip-chip packages were assembled with hundreds of micro-springs at 20 mum pad-pitch, 40 mum spring-pitch, and an operating force of 0.01...

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Bibliographic Details
Main Authors: Chow, E.M., Chua, C., Hantschel, T., van Schuylenbergh, K., Fork, D.K.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Contacts
Electrical resistance measurement
Gold
Humidity
Packaging
Performance evaluation
Pressure measurement
Testing
Thermal resistance
Online Access:Request full text
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Summary:This work investigates electrical pressure contacts based on a micro-spring with orders of magnitude smaller pitch and force than conventional pressure contacts. Flip-chip packages were assembled with hundreds of micro-springs at 20 mum pad-pitch, 40 mum spring-pitch, and an operating force of 0.01 gram on gold pads. These packages are shown to have stable resistance values during both in-situ thermocycle (0 degC to 125 degC) and humidity testing (60 degC at 95% RH). High-speed glitch measurements are performed to confirm the pressure contact does not have intermittent opens during thermocycling. These results suggest that a low-force solder-free pressure spring contact is a viable technology for next generation flip-chip packaging
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2005.1441413