A novel packaging methodology for spray cooling of power semiconductor devices using dielectric liquids

The heat flux requirements of present power electronics systems are exceeding 100 W/cm 2 and are predicted to reach the 1000 W/cm 2 range in the near future. Spray cooling is a cooling technology that can provide such enormous cooling demands. Direct spray cooling of power devices (e.g., IGBTs) that...

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Bibliographic Details
Main Authors: Vanam, K., Junghans, J., Barlow, F., Selvam, R.P., Balda, J.C., Elshabini, A.
Format: Conference Proceeding
Language:English
Subjects:
Dielectric liquids
Electronic equipment testing
Electronics cooling
Electronics packaging
Insulated gate bipolar transistors
Power electronics
Power semiconductor devices
Power system reliability
Semiconductor device packaging
Spraying
Online Access:Request full text
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Description
Summary:The heat flux requirements of present power electronics systems are exceeding 100 W/cm 2 and are predicted to reach the 1000 W/cm 2 range in the near future. Spray cooling is a cooling technology that can provide such enormous cooling demands. Direct spray cooling of power devices (e.g., IGBTs) that are conventionally wire-bonded creates long-term reliability problems. So in order to achieve the expected future heat load demands and improve the reliability of the system there is a need for novel packaging methodologies. This paper reports on an innovative packaging methodology and a test vehicle that demonstrates the potential of spray cooling power electronics. This paper describes the proposed methodology as well as the spraying parameters that affect the cooling
ISSN:1048-2334
2470-6647
DOI:10.1109/APEC.2005.1453335