Microwave operation of on-chip antenna embedded in WL-CSP [RFID applications]

An on-chip antenna for microwave operation is demonstrated. The application of wafer-level chip-scale package (WL-CSP) techniques such as dual Cu electroplating conductive layers, and thick resin layers separating the conductive layer more than 10 /spl mu/m from the Si substrate, allow on-chip integ...

Full description

Saved in:
Bibliographic Details
Main Authors: Abe, H., Sato, M., Itoi, K., Kawai, S., Tanaka, T., Hayashi, T., Saitoh, Y., Ito, T.
Format: Conference Proceeding
Language:English
Subjects:
Copper
Costs
Fabrication
Microwave antennas
Packaging
Radiofrequency identification
Resins
RFID tags
Transmitting antennas
Wafer scale integration
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:An on-chip antenna for microwave operation is demonstrated. The application of wafer-level chip-scale package (WL-CSP) techniques such as dual Cu electroplating conductive layers, and thick resin layers separating the conductive layer more than 10 /spl mu/m from the Si substrate, allow on-chip integration. Details of the antenna fabrication process and performance are presented. Antenna performance achieved a maximum communication range between the on-chip antenna and a transmission module of over 400 mm at a transmission signal power of 300 mW. WL-CSP techniques realize real chip-scale long communication range radio frequency identification (RFID) tags.
DOI:10.1109/IWAT.2005.1461031