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The influence of technological process on properties and reliability of thick film layers
Thick film layers, and their properties, are the topic of this paper. Attention is paid to thick film resistors and particularly their behavior in connection with the trimming process. The influence of two methods of trimming was investigated and compared. Some samples were trimmed by a milling cutt...
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container_end_page | 324 vol.2 |
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container_start_page | 322 |
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creator | Pelikanova, I.B. Konupka, T. |
description | Thick film layers, and their properties, are the topic of this paper. Attention is paid to thick film resistors and particularly their behavior in connection with the trimming process. The influence of two methods of trimming was investigated and compared. Some samples were trimmed by a milling cutter and other samples were trimmed by laser. The change of resistance and non linearity of C-V characteristics were measured. |
doi_str_mv | 10.1109/ISSE.2004.1490444 |
format | conference_proceeding |
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Attention is paid to thick film resistors and particularly their behavior in connection with the trimming process. The influence of two methods of trimming was investigated and compared. Some samples were trimmed by a milling cutter and other samples were trimmed by laser. 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Attention is paid to thick film resistors and particularly their behavior in connection with the trimming process. The influence of two methods of trimming was investigated and compared. Some samples were trimmed by a milling cutter and other samples were trimmed by laser. The change of resistance and non linearity of C-V characteristics were measured.</description><subject>Capacitance-voltage characteristics</subject><subject>Drilling machines</subject><subject>Electric resistance</subject><subject>Electrical resistance measurement</subject><subject>Laser beam cutting</subject><subject>Linearity</subject><subject>Milling</subject><subject>Resistors</subject><subject>Thick films</subject><subject>Voltage</subject><isbn>9780780384224</isbn><isbn>0780384229</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2004</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNotj8tOwzAURC0hJFDJB6Bu_AMJ1488vERVgUqVWDQbVpVjXzcGN4nssMjfU6CjkeZsZqQh5JFBwRiop93hsC04gCyYVCClvCGZqhu4WDSSc3lHspQ-4SKhZFVV9-Sj7ZH6wYVvHAzS0dEZTT-MYTx5owOd4mgwJToOvzhhnD0mqgdLIwavOx_8vPzVem--qPPhTINeMKYHcut0SJhdc0Xal227ecv376-7zfM-9wrm3CrgHTTOAvBa1VCWHas4CiwrhQa5BS2cLJtOdKWyyA1YI5xRTjlkEoRYkfX_rEfE4xT9WcfleP0vfgBdBFHt</recordid><startdate>2004</startdate><enddate>2004</enddate><creator>Pelikanova, I.B.</creator><creator>Konupka, T.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2004</creationdate><title>The influence of technological process on properties and reliability of thick film layers</title><author>Pelikanova, I.B. ; Konupka, T.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-d902b08fd002797055b162e3e569ece2d0a3f458b3b59de2c0dc3fc9f9fe14033</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Capacitance-voltage characteristics</topic><topic>Drilling machines</topic><topic>Electric resistance</topic><topic>Electrical resistance measurement</topic><topic>Laser beam cutting</topic><topic>Linearity</topic><topic>Milling</topic><topic>Resistors</topic><topic>Thick films</topic><topic>Voltage</topic><toplevel>online_resources</toplevel><creatorcontrib>Pelikanova, I.B.</creatorcontrib><creatorcontrib>Konupka, T.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Pelikanova, I.B.</au><au>Konupka, T.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>The influence of technological process on properties and reliability of thick film layers</atitle><btitle>27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004</btitle><stitle>ISSE</stitle><date>2004</date><risdate>2004</risdate><volume>2</volume><spage>322</spage><epage>324 vol.2</epage><pages>322-324 vol.2</pages><isbn>9780780384224</isbn><isbn>0780384229</isbn><abstract>Thick film layers, and their properties, are the topic of this paper. Attention is paid to thick film resistors and particularly their behavior in connection with the trimming process. The influence of two methods of trimming was investigated and compared. Some samples were trimmed by a milling cutter and other samples were trimmed by laser. The change of resistance and non linearity of C-V characteristics were measured.</abstract><pub>IEEE</pub><doi>10.1109/ISSE.2004.1490444</doi></addata></record> |
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identifier | ISBN: 9780780384224 |
ispartof | 27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004, 2004, Vol.2, p.322-324 vol.2 |
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language | eng |
recordid | cdi_ieee_primary_1490444 |
source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Capacitance-voltage characteristics Drilling machines Electric resistance Electrical resistance measurement Laser beam cutting Linearity Milling Resistors Thick films Voltage |
title | The influence of technological process on properties and reliability of thick film layers |
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