Temperature field simulation of thick-film microcircuits using finite element method

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Bibliographic Details
Main Authors: Bad, G., Kalita, W., Klepacki, D., Rozak, F., Weglarski, M.
Format: Conference Proceeding
Language:English
Subjects:
Boundary conditions
Boundary element methods
Circuit simulation
Differential equations
Finite difference methods
Finite element methods
Heat transfer
Mathematical analysis
Nonlinear equations
Temperature distribution
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ISSN:2161-2528
DOI:10.1109/ISSE.2005.1491015