The impact of manufacturing issues above lead free soldering alloys

Practically all microelectronic assemblies in use today utilize Pb-Sn solders for interconnection. With the advent of chip scale packaging technologies, the usage of solder connections has increased. The most widely used Pb-Sn solder has the eutectic composition. Emerging environmental regulations w...

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Bibliographic Details
Main Authors: Avram, A., Carstea, H., Tanase, M., Lie, I., Babaita, M.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Blood
Consumer electronics
Electronics industry
Environmentally friendly manufacturing techniques
Humans
Lead
Microelectronics
Occupational safety
Soldering
Online Access:Request full text
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Summary:Practically all microelectronic assemblies in use today utilize Pb-Sn solders for interconnection. With the advent of chip scale packaging technologies, the usage of solder connections has increased. The most widely used Pb-Sn solder has the eutectic composition. Emerging environmental regulations worldwide, most notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has made the search for suitable "Pb-free" solders an important issue for microelectronics assembly
ISSN:2161-2528
DOI:10.1109/ISSE.2005.1491043