Advanced failure analysis of circuit-under-pad (CUP) structures in Cu/FSG and Cu/low k technologies

In this paper, we describe new failure modes for CUP devices fabricated with copper technology, and associated failure analysis (FA) challenges are discussed. Fabrication processing and assembly/package related reliability issues on Cu/low k technology are addressed. In addition, failure analysis te...

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Bibliographic Details
Main Authors: Huixian Wu, Archer, V., Merchant, S.M., Cargo, J., Chesire, D., Antol, J., Mengel, R., Osenbach, J., Horvat, S., Peridier, C., White, M.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Bonding
Chemical technology
Copper
Fabrication
Failure analysis
Integrated circuit technology
Packaging
Scanning electron microscopy
Wet etching
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Summary:In this paper, we describe new failure modes for CUP devices fabricated with copper technology, and associated failure analysis (FA) challenges are discussed. Fabrication processing and assembly/package related reliability issues on Cu/low k technology are addressed. In addition, failure analysis techniques for copper technology CUP devices have been developed and are treated. Several backside FA deprocessing and cross-section techniques for CUP devices including: reactive ion etching (RIE), parallel polishing, wet chemical etching, chemical mechanical polishing (CMP), focused ion beam (FIB), scanning electron microscopy (SEM), and a combination of these techniques, are addressed. Finally, some case studies on CUP structures with Cu/fluorine silica glass (FSG), Cu/low k technologies are presented.
ISSN:1541-7026
1938-1891
DOI:10.1109/RELPHY.2005.1493100