Effects of stress on the temperature coefficient of frequency in double clamped resonators

This paper presents a theoretical framework for evaluating the temperature coefficient of frequency (TCf) of double clamped resonators due to stresses induced by the die and through die packaging. It is desirable to have a zero TCf such that the resonator frequency is stable over a broad temperature...

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Bibliographic Details
Main Authors: Melamud, R., Hopcroft, M., Jha, C., Bongsang Kim, Chandorkar, S., Candler, R., Kenny, T.W.
Format: Conference Proceeding
Language:English
Subjects:
Analytical models
Finite element methods
Material properties
Packaging
Resonant frequency
Softening
Temperature dependence
Temperature distribution
Thermal stresses
Transistors
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Summary:This paper presents a theoretical framework for evaluating the temperature coefficient of frequency (TCf) of double clamped resonators due to stresses induced by the die and through die packaging. It is desirable to have a zero TCf such that the resonator frequency is stable over a broad temperature range. The TCf depends on how the resonator's material properties, dimensions, and stresses change with temperature. A passive method of using thin film induced stresses in an encapsulated resonator to compensate for material softening is explored. By using a combination of finite element and analytical models it is possible to predict the TCf and improve thermal frequency stability of micromachined resonators.
ISSN:2159-547X
DOI:10.1109/SENSOR.2005.1496438