Novel packaging of parallel-optical interconnects for high-end servers

A novel packaging concept is demonstrated where parallel-optical subassemblies are mounted on the same substrate as processor chips for processor-to-processor communication within a high-end server. A single-channel bit-error ratio

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Bibliographic Details
Main Authors: Rosenau, S.A., Simon, J., Windover, L.A.B., Law, B., Flower, G.M., DeGroot, E., Grot, A., Nystrom, M.J., Chao-Kun Lin, Tandon, A., Djordjev, K., Tan, M.R.T., Mirkarimi, L.W., Gruhlke, R.W., Hui Xia, Rankin, G., Ali, M.E., Lemoff, B.E., Giboney, K.S., Dolfi, D.W., Colgan, E.G., Furman, B., Magerlein, J., Schaub, J., Stigliani, D., Torok, J., Becker, D., Katopis, G., Dyckman, W., O'Connor, D.
Format: Conference Proceeding
Language:English
Subjects:
Aggregates
Bandwidth
Connectors
Design optimization
Integrated circuit interconnections
Laboratories
Open source hardware
Optical interconnections
Packaging
Routing
Online Access:Request full text
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Summary:A novel packaging concept is demonstrated where parallel-optical subassemblies are mounted on the same substrate as processor chips for processor-to-processor communication within a high-end server. A single-channel bit-error ratio
DOI:10.1109/OFC.2005.193028