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Novel packaging of parallel-optical interconnects for high-end servers
A novel packaging concept is demonstrated where parallel-optical subassemblies are mounted on the same substrate as processor chips for processor-to-processor communication within a high-end server. A single-channel bit-error ratio
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| container_start_page | 3 pp. Vol. 4 |
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| creator | Rosenau, S.A. Simon, J. Windover, L.A.B. Law, B. Flower, G.M. DeGroot, E. Grot, A. Nystrom, M.J. Chao-Kun Lin Tandon, A. Djordjev, K. Tan, M.R.T. Mirkarimi, L.W. Gruhlke, R.W. Hui Xia Rankin, G. Ali, M.E. Lemoff, B.E. Giboney, K.S. Dolfi, D.W. Colgan, E.G. Furman, B. Magerlein, J. Schaub, J. Stigliani, D. Torok, J. Becker, D. Katopis, G. Dyckman, W. O'Connor, D. |
| description | A novel packaging concept is demonstrated where parallel-optical subassemblies are mounted on the same substrate as processor chips for processor-to-processor communication within a high-end server. A single-channel bit-error ratio |
| doi_str_mv | 10.1109/OFC.2005.193028 |
| format | conference_proceeding |
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| identifier | ISBN: 1557527830 |
| ispartof | OFC/NFOEC Technical Digest. Optical Fiber Communication Conference, 2005, 2005, Vol.4, p.3 pp. Vol. 4 |
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| language | eng |
| recordid | cdi_ieee_primary_1501567 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Aggregates Bandwidth Connectors Design optimization Integrated circuit interconnections Laboratories Open source hardware Optical interconnections Packaging Routing |
| title | Novel packaging of parallel-optical interconnects for high-end servers |
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