Post-WCMP leakage detection and monitoring on 65-nm devices using an advanced e-beam inspection system

N+/P-well junction leakage was studied with an electron beam (e-beam) inspection system by detection of the gray level of the tungsten plug (W-plug) in the defect images of post tungsten chemical mechanical polish (WCMP) inspection. Leakage results of wafer acceptance tests (WAT) show a strong corre...

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Bibliographic Details
Main Authors: Wang, K., Liu, H., Yeh, J.H., Mingsheng Tsai, Wei-Yih Wu, Hong-Chi Wu, Hong Xiao, Jau, J.
Format: Conference Proceeding
Language:English
Subjects:
Chemicals
Electron beams
Failure analysis
Inspection
Leak detection
Monitoring
Nickel
Plugs
Testing
Tungsten
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Description
Summary:N+/P-well junction leakage was studied with an electron beam (e-beam) inspection system by detection of the gray level of the tungsten plug (W-plug) in the defect images of post tungsten chemical mechanical polish (WCMP) inspection. Leakage results of wafer acceptance tests (WAT) show a strong correlation with the e-beam inspection results. Failure analysis results reveal that the junction leakage is caused by lateral diffusion of nickel silicide underneath the spacer. The extrusion length correlates with the gray level of the tungsten plug very well.
ISSN:1523-553X
DOI:10.1109/ISSM.2005.1513409