A robust MEMS probe card for fine pitch test using a new cantilever moving scheme

A vertically guided MEMS probe card, designed to achieve a deflection of 50 mum at a force of 1.5 gram (g) and less than 50 mum of pad pitch, was developed. Based on our experimental results, the measured average contact resistance was approximately 0.2 ohm (Q at 1.44 g of force with leakage current...

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Bibliographic Details
Main Authors: Doo-Yun Chung, Bong-Hwan Kim, Chi-Hwan Chung, Choon-Bae Park, Jong-Ho Lee, Kukjin Chun
Format: Conference Proceeding
Language:English
Subjects:
Contact resistance
Current measurement
Electrical resistance measurement
Force measurement
Leakage current
Micromechanical devices
Probes
Q measurement
Robustness
Testing
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Summary:A vertically guided MEMS probe card, designed to achieve a deflection of 50 mum at a force of 1.5 gram (g) and less than 50 mum of pad pitch, was developed. Based on our experimental results, the measured average contact resistance was approximately 0.2 ohm (Q at 1.44 g of force with leakage current approximately 10 pA between the tips and pads. In addition, tip planarity was about plusmn6 mum with x-y alignment errors within plusmn8 mum. A reliability test was performed, the average contact resistance was 0.4 Omega and the probe tip wear was less than 1 mum after the 10,000 time touchdowns. This newly proposed probe card is suitable for wafer-level testing and fine pitch device testing
ISSN:1930-0395
2168-9229
DOI:10.1109/ICSENS.2005.1597964