Carrier transport in HfO/sub 2//metal gate MOSFETs: physical insight into critical parameters

Electron and hole mobility in HfO/sub 2//metal gate MOSFETs is deeply studied through low-temperature measurements down to 4.2 K. Original technological splits allow the decorrelation of the different scattering mechanisms. It is found that even when charge trapping is negligible, strong remote coul...

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Bibliographic Details
Published in:IEEE transactions on electron devices 2006-04, Vol.53 (4), p.759-768
Main Authors: Casse, M., Thevenod, L., Guillaumot, B., Tosti, L., Martin, F., Mitard, J., Weber, O., Andrieu, F., Ernst, T., Reimbold, G., Billon, T., Mouis, M., Boulanger, F.
Format: Article
Language:English
Subjects:
Charge carrier lifetime
Charge carrier mobility
Dielectric materials
Hafnium compounds
metal gate
MOSFETs
Silicon compounds
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Summary:Electron and hole mobility in HfO/sub 2//metal gate MOSFETs is deeply studied through low-temperature measurements down to 4.2 K. Original technological splits allow the decorrelation of the different scattering mechanisms. It is found that even when charge trapping is negligible, strong remote coulomb scattering (RCS) due to fixed charges or dipoles causes most of the mobility degradation. The effective charges are found to be located in the HfO/sub 2/ near the SiO/sub 2/ interface within 2 nm. Experimental results are well reproduced by RCS calculation using 7/spl times/10/sup 13/ cm/sup -2/ fixed charges at the HfO/sub 2//SiO/sub 2/ interface. We also discuss the role of remote phonon scattering in such gate stacks. Interactions with surface soft-optical phonon of HfO/sub 2/ are clearly evidenced for a metal gate but remain of second order. All these remote interactions are significant for an interfacial oxide thickness up to 2 nm, over which, these are negligible. Finally, the metal gate (TiN) itself induces a modified surface-roughness term that impacts the low to high effective field mobility even for the SiO/sub 2/ gate dielectric references.
ISSN:0018-9383
1557-9646
DOI:10.1109/TED.2006.870888