Task scheduling control of BGA solder joint process in flexible manufacturing system

This paper describes an open loop control method of the solder joint process in a rework station for faulty printed circuit board (PCBs) containing electronic components in packages ball grid arrays (BGAs). In particular, a mathematical model describing the solder joint process is, first of all, obt...

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Bibliographic Details
Main Authors: Alonge, F., D'Ippolito, F., Raimondi, P.M., Aiello, V.
Format: Conference Proceeding
Language:English
Subjects:
Circuit faults
Control systems
Electronic components
Electronic packaging thermal management
Flexible manufacturing systems
Flexible printed circuits
Job shop scheduling
Mathematical model
Open loop systems
Soldering
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Description
Summary:This paper describes an open loop control method of the solder joint process in a rework station for faulty printed circuit board (PCBs) containing electronic components in packages ball grid arrays (BGAs). In particular, a mathematical model describing the solder joint process is, first of all, obtained. Then, the desired thermal profile of the junctions BGA-PCB is determined according to the physical constraints of the rework station framework. The control parameters corresponding to the above desired thermal profile are identified using the above mathematical model. Finally, the open loop control algorithm is implemented on the supervisor interface of the rework station in order to carried out experimental validation of the proposed method
ISSN:1946-0740
1946-0759
DOI:10.1109/ETFA.2005.1612677