Evaporator/boiler design for thermosyphons utilizing segregated hydrofluoroether working fluids

In this work, a new micro porous metallic coating method is used to produce two compact boiler assemblies that are practical for use in thermosyphons in electronics systems. These assemblies were tested using a segregated hydrofluoroether (HFE) working fluid C 3 F 7 OCH 3 on 1.0, 4.0 and 13.7 cm 2 h...

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Bibliographic Details
Main Author: Tuma, P.E.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Boilers
Electronics cooling
Heat sinks
Heat transfer
Hydrocarbons
Semiconductor device measurement
Temperature
Testing
Thermal resistance
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Summary:In this work, a new micro porous metallic coating method is used to produce two compact boiler assemblies that are practical for use in thermosyphons in electronics systems. These assemblies were tested using a segregated hydrofluoroether (HFE) working fluid C 3 F 7 OCH 3 on 1.0, 4.0 and 13.7 cm 2 heat sources at atmospheric pressure. The best of these yielded sink-to-fluid resistances, R sf , at 230W of 0.092, 0.047 and 0.024degC/W, respectively. This boiler assembly was incorporated into a thermosyphon with a remote 100times100times2.2mm finned-tube condenser that produced a condensation resistance, R fa , of ~0.1degC/W with a 7.6W 92times3 8mm fan. That thermosyphon was tested on the aforementioned heat sources yielding much improved R sf values of 0.083, 0.026 and 0.014degC/W at 150W. Data gathered with larger condensers or more powerful fans suggest that it is quite practical to produce a compact thermosyphon that can cool a 20mm device generating 250W with R sa
ISSN:1065-2221
2577-1000
DOI:10.1109/STHERM.2006.1625209