Loading…

Optimization of microchannel heat sinks using entropy generation minimization method

In this study, an entropy generation minimization (EGM) procedure is employed to optimize the overall performance of microchannel heat sinks. This allows the combined effects of thermal resistance and pressure drop to be assessed simultaneously as the heat sink interacts with the surrounding flow fi...

Full description

Saved in:
Bibliographic Details
Main Authors: Khan, W.A., Yovanovich, M.M., Culham, J.R.
Format: Conference Proceeding
Language:English
Subjects:
Citations: Items that cite this one
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
cited_by cdi_FETCH-LOGICAL-c225t-1feb1393bd15297f500f83ce446bef29564f7c0157921a3d3d32c21d67d564e73
cites
container_end_page 86
container_issue
container_start_page 78
container_title
container_volume
creator Khan, W.A.
Yovanovich, M.M.
Culham, J.R.
description In this study, an entropy generation minimization (EGM) procedure is employed to optimize the overall performance of microchannel heat sinks. This allows the combined effects of thermal resistance and pressure drop to be assessed simultaneously as the heat sink interacts with the surrounding flow field. New general expressions for the entropy generation rate are developed by considering an appropriate control volume and applying mass, energy, and entropy balances. The effect of channel aspect ratio, fin spacing ratio, heat sink material, Knudsen numbers and accommodation coefficients on the entropy generation rate is investigated in the slip flow region. Analytical/empirical correlations are used for heat transfer and friction coefficients, where the characteristic length is used as the hydraulic diameter of the channel. A parametric study is also performed to show the effects of different design variables on the overall performance of microchannel heat sinks
doi_str_mv 10.1109/STHERM.2006.1625210
format conference_proceeding
fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_1625210</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1625210</ieee_id><sourcerecordid>1625210</sourcerecordid><originalsourceid>FETCH-LOGICAL-c225t-1feb1393bd15297f500f83ce446bef29564f7c0157921a3d3d32c21d67d564e73</originalsourceid><addsrcrecordid>eNpFUMtKw0AUHXyAafULupkfSJx752WWUqoVKgWN65LHnWa0mYQkLurXN9CCnMVZnAecw9gCRAIg0sfPbL36eE9QCJOAQY0grliE2toYhBDXbAYKlRKgpbphEQijY0SEOzYbhu_JYdHoiGXbbvSN_8tH3wbeOt74sm_LOg-BDrymfOSDDz8D_51ozymMfdsd-Z4C9edM48N_QUNj3Vb37Nblh4EeLjxnXy-rbLmON9vXt-XzJi4R9RiDowJkKosKNKbWaSHckyxJKVOQw1Qb5Ww5LbApQi6rCVgiVMZWk0RWztni3OuJaNf1vsn74-7yhjwBvm5TRA</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Optimization of microchannel heat sinks using entropy generation minimization method</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Khan, W.A. ; Yovanovich, M.M. ; Culham, J.R.</creator><creatorcontrib>Khan, W.A. ; Yovanovich, M.M. ; Culham, J.R.</creatorcontrib><description>In this study, an entropy generation minimization (EGM) procedure is employed to optimize the overall performance of microchannel heat sinks. This allows the combined effects of thermal resistance and pressure drop to be assessed simultaneously as the heat sink interacts with the surrounding flow field. New general expressions for the entropy generation rate are developed by considering an appropriate control volume and applying mass, energy, and entropy balances. The effect of channel aspect ratio, fin spacing ratio, heat sink material, Knudsen numbers and accommodation coefficients on the entropy generation rate is investigated in the slip flow region. Analytical/empirical correlations are used for heat transfer and friction coefficients, where the characteristic length is used as the hydraulic diameter of the channel. A parametric study is also performed to show the effects of different design variables on the overall performance of microchannel heat sinks</description><identifier>ISSN: 1065-2221</identifier><identifier>ISBN: 1424401534</identifier><identifier>ISBN: 9781424401536</identifier><identifier>EISSN: 2577-1000</identifier><identifier>DOI: 10.1109/STHERM.2006.1625210</identifier><language>eng</language><publisher>IEEE</publisher><subject>Entropy ; Genetic expression ; Heat sinks ; Heat transfer ; Microchannel ; Minimization methods ; Optimization methods ; Resistance heating ; Thermal resistance ; Weight control</subject><ispartof>Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, 2006, p.78-86</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c225t-1feb1393bd15297f500f83ce446bef29564f7c0157921a3d3d32c21d67d564e73</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1625210$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54555,54920,54932</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1625210$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Khan, W.A.</creatorcontrib><creatorcontrib>Yovanovich, M.M.</creatorcontrib><creatorcontrib>Culham, J.R.</creatorcontrib><title>Optimization of microchannel heat sinks using entropy generation minimization method</title><title>Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium</title><addtitle>STHERM</addtitle><description>In this study, an entropy generation minimization (EGM) procedure is employed to optimize the overall performance of microchannel heat sinks. This allows the combined effects of thermal resistance and pressure drop to be assessed simultaneously as the heat sink interacts with the surrounding flow field. New general expressions for the entropy generation rate are developed by considering an appropriate control volume and applying mass, energy, and entropy balances. The effect of channel aspect ratio, fin spacing ratio, heat sink material, Knudsen numbers and accommodation coefficients on the entropy generation rate is investigated in the slip flow region. Analytical/empirical correlations are used for heat transfer and friction coefficients, where the characteristic length is used as the hydraulic diameter of the channel. A parametric study is also performed to show the effects of different design variables on the overall performance of microchannel heat sinks</description><subject>Entropy</subject><subject>Genetic expression</subject><subject>Heat sinks</subject><subject>Heat transfer</subject><subject>Microchannel</subject><subject>Minimization methods</subject><subject>Optimization methods</subject><subject>Resistance heating</subject><subject>Thermal resistance</subject><subject>Weight control</subject><issn>1065-2221</issn><issn>2577-1000</issn><isbn>1424401534</isbn><isbn>9781424401536</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2006</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNpFUMtKw0AUHXyAafULupkfSJx752WWUqoVKgWN65LHnWa0mYQkLurXN9CCnMVZnAecw9gCRAIg0sfPbL36eE9QCJOAQY0grliE2toYhBDXbAYKlRKgpbphEQijY0SEOzYbhu_JYdHoiGXbbvSN_8tH3wbeOt74sm_LOg-BDrymfOSDDz8D_51ozymMfdsd-Z4C9edM48N_QUNj3Vb37Nblh4EeLjxnXy-rbLmON9vXt-XzJi4R9RiDowJkKosKNKbWaSHckyxJKVOQw1Qb5Ww5LbApQi6rCVgiVMZWk0RWztni3OuJaNf1vsn74-7yhjwBvm5TRA</recordid><startdate>2006</startdate><enddate>2006</enddate><creator>Khan, W.A.</creator><creator>Yovanovich, M.M.</creator><creator>Culham, J.R.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>2006</creationdate><title>Optimization of microchannel heat sinks using entropy generation minimization method</title><author>Khan, W.A. ; Yovanovich, M.M. ; Culham, J.R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c225t-1feb1393bd15297f500f83ce446bef29564f7c0157921a3d3d32c21d67d564e73</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Entropy</topic><topic>Genetic expression</topic><topic>Heat sinks</topic><topic>Heat transfer</topic><topic>Microchannel</topic><topic>Minimization methods</topic><topic>Optimization methods</topic><topic>Resistance heating</topic><topic>Thermal resistance</topic><topic>Weight control</topic><toplevel>online_resources</toplevel><creatorcontrib>Khan, W.A.</creatorcontrib><creatorcontrib>Yovanovich, M.M.</creatorcontrib><creatorcontrib>Culham, J.R.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library Online</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Khan, W.A.</au><au>Yovanovich, M.M.</au><au>Culham, J.R.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Optimization of microchannel heat sinks using entropy generation minimization method</atitle><btitle>Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium</btitle><stitle>STHERM</stitle><date>2006</date><risdate>2006</risdate><spage>78</spage><epage>86</epage><pages>78-86</pages><issn>1065-2221</issn><eissn>2577-1000</eissn><isbn>1424401534</isbn><isbn>9781424401536</isbn><abstract>In this study, an entropy generation minimization (EGM) procedure is employed to optimize the overall performance of microchannel heat sinks. This allows the combined effects of thermal resistance and pressure drop to be assessed simultaneously as the heat sink interacts with the surrounding flow field. New general expressions for the entropy generation rate are developed by considering an appropriate control volume and applying mass, energy, and entropy balances. The effect of channel aspect ratio, fin spacing ratio, heat sink material, Knudsen numbers and accommodation coefficients on the entropy generation rate is investigated in the slip flow region. Analytical/empirical correlations are used for heat transfer and friction coefficients, where the characteristic length is used as the hydraulic diameter of the channel. A parametric study is also performed to show the effects of different design variables on the overall performance of microchannel heat sinks</abstract><pub>IEEE</pub><doi>10.1109/STHERM.2006.1625210</doi><tpages>9</tpages></addata></record>
fulltext fulltext_linktorsrc
identifier ISSN: 1065-2221
ispartof Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, 2006, p.78-86
issn 1065-2221
2577-1000
language eng
recordid cdi_ieee_primary_1625210
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Entropy
Genetic expression
Heat sinks
Heat transfer
Microchannel
Minimization methods
Optimization methods
Resistance heating
Thermal resistance
Weight control
title Optimization of microchannel heat sinks using entropy generation minimization method
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-21T15%3A07%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Optimization%20of%20microchannel%20heat%20sinks%20using%20entropy%20generation%20minimization%20method&rft.btitle=Twenty-Second%20Annual%20IEEE%20Semiconductor%20Thermal%20Measurement%20And%20Management%20Symposium&rft.au=Khan,%20W.A.&rft.date=2006&rft.spage=78&rft.epage=86&rft.pages=78-86&rft.issn=1065-2221&rft.eissn=2577-1000&rft.isbn=1424401534&rft.isbn_list=9781424401536&rft_id=info:doi/10.1109/STHERM.2006.1625210&rft_dat=%3Cieee_6IE%3E1625210%3C/ieee_6IE%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c225t-1feb1393bd15297f500f83ce446bef29564f7c0157921a3d3d32c21d67d564e73%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1625210&rfr_iscdi=true