Clean Dicing of Compound Semiconductors Using the Water-Jet Guided Laser Technology

The water-jet-guided laser is a new technology for micro machining that combines a laser beam into a hair-thin, low-pressure water jet for wafer dicing. In addition to silicon, it can dice compound semiconductors such as GaAs, InP and SiC without damage

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Bibliographic Details
Main Authors: Perrottet, D., Green, S., Richerzhagen, B.
Format: Conference Proceeding
Language:English
Subjects:
Abrasives
Contamination
Gallium arsenide
Laser beam cutting
Optical materials
Semiconductor lasers
Semiconductor materials
Surface emitting lasers
Water jet cutting
Water pollution
Online Access:Request full text
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Description
Summary:The water-jet-guided laser is a new technology for micro machining that combines a laser beam into a hair-thin, low-pressure water jet for wafer dicing. In addition to silicon, it can dice compound semiconductors such as GaAs, InP and SiC without damage
ISSN:1078-8743
2376-6697
DOI:10.1109/ASMC.2006.1638759