Packaging of MMICs in multilayer LCP substrates

A 13-25-GHz GaAs bare die low noise amplifier is embedded inside a multilayer liquid crystal polymer (LCP) package made from seven layers of thin-film LCP. This new packaging topology has inherently unique properties that could make it an attractive alternative in some instances to traditional metal...

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Bibliographic Details
Published in:IEEE microwave and wireless components letters 2006-07, Vol.16 (7), p.410-412
Main Authors: Thompson, D.C., Tentzeris, M.M., Papapolymerou, J.
Format: Article
Language:English
Subjects:
Amplifiers
Applied sciences
Ceramics
Circuit properties
Design. Technologies. Operation analysis. Testing
Electric, optical and optoelectronic circuits
Electronic circuits
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Embedded actives
Exact sciences and technology
Gallium arsenide
Integrated circuit packaging
Integrated circuits
Laminates
laser machining
liquid crystal polymer (LCP)
Liquid crystal polymers
Low-noise amplifiers
Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits
Microwaves
MMICs
monolithic microwave integrated circuit (MMIC)
Multilayers
Nonhomogeneous media
organics
package
Packages
Packaging
Packaging machines
Radio frequencies
Radio frequency
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Substrates
three-dimensional (3-D) integration
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Description
Summary:A 13-25-GHz GaAs bare die low noise amplifier is embedded inside a multilayer liquid crystal polymer (LCP) package made from seven layers of thin-film LCP. This new packaging topology has inherently unique properties that could make it an attractive alternative in some instances to traditional metal and ceramic hermetic packages. LCP is a near-hermetic material and its lamination process is at a relatively low temperature (285degC versus >800degC for ceramics). The active device is enclosed in a package consisting of several laminated C0 2 laser machined LCP superstrate layers. Measurements demonstrate that the LCP package and the 285degC packaging process have minimal effects on the monolithic microwave integrated circuit radio frequency (RF) performance. These findings show that both active and passive devices can be integrated together in a homogeneous laminated multilayer LCP package. This active/passive compatibility demonstrates a unique capability of LCP to form compact, vertically integrated (3-D) RF system-on-a-package modules
ISSN:1531-1309
2771-957X
1558-1764
2771-9588
DOI:10.1109/LMWC.2006.877130