Area array encapsulation with stencil printing and microwave curing

An alternative to the transfer molding of area array packages is the stencil printing of the encapsulant followed by a variable frequency microwave (VFM) cure process. A block of epoxy encapsulant resin was stencil printed over a square array of ICs bonded to a printed circuit board. The board circu...

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Bibliographic Details
Main Authors: Hubbard, R.L., Fathi, Z., Ahmad, I., Schake, J., Zhao, R., Toleno, B.
Format: Conference Proceeding
Language:English
Subjects:
Bonding
Curing
Encapsulation
Frequency
Microwave antenna arrays
Microwave ovens
Packaging
Printing
Resins
Transfer molding
Online Access:Request full text
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Summary:An alternative to the transfer molding of area array packages is the stencil printing of the encapsulant followed by a variable frequency microwave (VFM) cure process. A block of epoxy encapsulant resin was stencil printed over a square array of ICs bonded to a printed circuit board. The board circuitry included tuned microwave structures that focused curing of the edges of the encapsulant while the bulk was cured in the VFM oven at a low temperature in just a few minutes. A void free, fully cured encapsulant was produced with the same dimensions as the stencil and with satisfactory mechanical properties
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2006.1645693