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System for deposition and characterization of polypyrrole/gold bilayer hinges
We report on a custom designed system for the deposition and characterization of polypyrrole bilayer actuators. Unlike conventional commercial electrochemical cells and potentiostats, the system described in this paper has specifications commensurate to its application and thus can be readily implem...
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creator | Choi, E. Liu, Y. Smela, E. Andreou, A.G. |
description | We report on a custom designed system for the deposition and characterization of polypyrrole bilayer actuators. Unlike conventional commercial electrochemical cells and potentiostats, the system described in this paper has specifications commensurate to its application and thus can be readily implemented using off the shelf electronic components at relatively low cost. Deposition rates and actuation are computer controlled through a standard data acquisition interface card with a program written in Matlab. We also discuss the design of the masks that are employed to fabricate the polypyrrole structures. This is accomplished through silicon compilation using the CAD software LEDIT (1999) from Tanner Research. We have implemented a selection of parameterized routines in the LEDIT script language LComp that greatly reduces design turnaround time |
doi_str_mv | 10.1109/ISCAS.2006.1693382 |
format | conference_proceeding |
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Unlike conventional commercial electrochemical cells and potentiostats, the system described in this paper has specifications commensurate to its application and thus can be readily implemented using off the shelf electronic components at relatively low cost. Deposition rates and actuation are computer controlled through a standard data acquisition interface card with a program written in Matlab. We also discuss the design of the masks that are employed to fabricate the polypyrrole structures. This is accomplished through silicon compilation using the CAD software LEDIT (1999) from Tanner Research. We have implemented a selection of parameterized routines in the LEDIT script language LComp that greatly reduces design turnaround time</description><subject>Actuators</subject><subject>Application software</subject><subject>Computer interfaces</subject><subject>Costs</subject><subject>Data acquisition</subject><subject>Design automation</subject><subject>Electronic components</subject><subject>Fasteners</subject><subject>Gold</subject><subject>Silicon</subject><issn>0271-4302</issn><issn>2158-1525</issn><isbn>0780393899</isbn><isbn>9780780393899</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2006</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNotkMtuwjAQRa0-pFLKD7Qb_0BgxhMTe4lQH0hUXaRdo0nsgKuAIyeb9OuLWu7m6tzFWVwhHhHmiGAXm3K9KucKYDnHpSUy6kpMFGqToVb6WtxDYYAsGWtvxARUgVlOoO7ErO-_4Zxcnxkm4r0c-8EfZROTdL6LfRhCPEk-OVkfOHE9-BR--G-MjexiO3ZjSrH1i31snaxCy6NP8hBOe98_iNuG297PLj0VXy_Pn-u3bPvxulmvtllA0ENmla4Z2S0NN8qaumgUF5YNKWcKqB2iZWtNTlQ5q40m7bSrnEbtgdARTcXTvzd473ddCkdO4-7yBP0CZD1Q_w</recordid><startdate>2006</startdate><enddate>2006</enddate><creator>Choi, E.</creator><creator>Liu, Y.</creator><creator>Smela, E.</creator><creator>Andreou, A.G.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>2006</creationdate><title>System for deposition and characterization of polypyrrole/gold bilayer hinges</title><author>Choi, E. ; Liu, Y. ; Smela, E. ; Andreou, A.G.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i105t-925ca1ad68af298c7f2a79a832d870cd119a998433bd958535d5dbd515e031d33</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Actuators</topic><topic>Application software</topic><topic>Computer interfaces</topic><topic>Costs</topic><topic>Data acquisition</topic><topic>Design automation</topic><topic>Electronic components</topic><topic>Fasteners</topic><topic>Gold</topic><topic>Silicon</topic><toplevel>online_resources</toplevel><creatorcontrib>Choi, E.</creatorcontrib><creatorcontrib>Liu, Y.</creatorcontrib><creatorcontrib>Smela, E.</creatorcontrib><creatorcontrib>Andreou, A.G.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE/IET Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Choi, E.</au><au>Liu, Y.</au><au>Smela, E.</au><au>Andreou, A.G.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>System for deposition and characterization of polypyrrole/gold bilayer hinges</atitle><btitle>2006 IEEE International Symposium on Circuits and Systems (ISCAS)</btitle><stitle>ISCAS</stitle><date>2006</date><risdate>2006</risdate><spage>4 pp.</spage><epage>3509</epage><pages>4 pp.-3509</pages><issn>0271-4302</issn><eissn>2158-1525</eissn><isbn>0780393899</isbn><isbn>9780780393899</isbn><abstract>We report on a custom designed system for the deposition and characterization of polypyrrole bilayer actuators. Unlike conventional commercial electrochemical cells and potentiostats, the system described in this paper has specifications commensurate to its application and thus can be readily implemented using off the shelf electronic components at relatively low cost. Deposition rates and actuation are computer controlled through a standard data acquisition interface card with a program written in Matlab. We also discuss the design of the masks that are employed to fabricate the polypyrrole structures. This is accomplished through silicon compilation using the CAD software LEDIT (1999) from Tanner Research. We have implemented a selection of parameterized routines in the LEDIT script language LComp that greatly reduces design turnaround time</abstract><pub>IEEE</pub><doi>10.1109/ISCAS.2006.1693382</doi></addata></record> |
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identifier | ISSN: 0271-4302 |
ispartof | 2006 IEEE International Symposium on Circuits and Systems (ISCAS), 2006, p.4 pp.-3509 |
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language | eng |
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source | IEEE Xplore All Conference Series |
subjects | Actuators Application software Computer interfaces Costs Data acquisition Design automation Electronic components Fasteners Gold Silicon |
title | System for deposition and characterization of polypyrrole/gold bilayer hinges |
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