EM-based analytical model for estimation of worst-case crosstalk noise

With the continued scaling of feature sizes in deep submicron technology, on-chip interconnects have become a dominant factor affecting performance and reliability in high performance integrated circuits (IC). The longer on-chip interconnects coupled with a decrease in wire width and wire separation...

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Bibliographic Details
Main Authors: Kadim, H.J., Coulibaly, L.M.
Format: Conference Proceeding
Language:English
Subjects:
Analytical models
Coupling circuits
Crosstalk
Inductance
Integrated circuit interconnections
Integrated circuit noise
Integrated circuit reliability
Integrated circuit technology
Mutual coupling
Wire
Online Access:Request full text
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Description
Summary:With the continued scaling of feature sizes in deep submicron technology, on-chip interconnects have become a dominant factor affecting performance and reliability in high performance integrated circuits (IC). The longer on-chip interconnects coupled with a decrease in wire width and wire separation, inductive effects, and more specifically, mutual inductance coupling between neighbouring wires become non-negligible. An electromagnetic (EM)-based analytical model for the estimation of the noise peak voltage of the victim line under worst-case crosstalk noise effect is presented
ISSN:0271-4302
2158-1525
DOI:10.1109/ISCAS.2006.1693542