Concept for an Alternative Solder-Free Flip-Chip Technique on SOI using Black-Silicon

Black-silicon regions are defined on an SOI board and covered with an adhesion layer. The contacts of to be mounted devices are pushed towards these regions, to establish a mechanical, electrical, and thermal contact

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Bibliographic Details
Main Authors: Schnarrenberger, M., Zimmermann, L., Mitze, T., Voigt, K., Bruns, J., Petermann, K.
Format: Conference Proceeding
Language:English
Subjects:
Bonding
Contacts
Dry etching
Electronic packaging thermal management
Gold
Manufacturing processes
Optical waveguides
Silicon
Surface emitting lasers
Waveguide lasers
Online Access:Request full text
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Description
Summary:Black-silicon regions are defined on an SOI board and covered with an adhesion layer. The contacts of to be mounted devices are pushed towards these regions, to establish a mechanical, electrical, and thermal contact
ISSN:1949-2081
1949-209X
DOI:10.1109/GROUP4.2006.1708209