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Determination of Surface Depletion Thickness of p-doped Silicon Nanowires Synthesized Using Metal Catalyzed CVD Process
An in-depth understanding of the distribution and impact of doping in nanowires is crucial for the rational design of future nanowire based devices synthesized using bottom-up techniques. We used a very slow wet chemical etchant for progressive reduction of the diameters of boron-doped, metal-cataly...
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creator | Kimukin, I. Long Do Islam, M.S. Anwar, A.F.M. |
description | An in-depth understanding of the distribution and impact of doping in nanowires is crucial for the rational design of future nanowire based devices synthesized using bottom-up techniques. We used a very slow wet chemical etchant for progressive reduction of the diameters of boron-doped, metal-catalyzed silicon nanowires with diverse diameters and lengths. The low temperature process helped avert the dopant segregation which is common in high temperature processes such as oxidation for diameter reduction. We ensured identical surface conditions subsequent to diameter reduction with wet-chemical etching and, using DC current-voltage measurements, found the resistance to increase with decreasing diameter. As the diameters were shrunk from a larger diameter to ∼50 nm in diameter, they exhibited a strong non-linear increase of the resistance indicating complete depletion of the cross-section caused by surface charges. The dopant concentration of the nanowires was calculated to be 2.1×10 18 cm -3 and the corresponding surface charge density was around 2.6×10 12 cm -2 . |
doi_str_mv | 10.1109/NANO.2006.247679 |
format | conference_proceeding |
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We used a very slow wet chemical etchant for progressive reduction of the diameters of boron-doped, metal-catalyzed silicon nanowires with diverse diameters and lengths. The low temperature process helped avert the dopant segregation which is common in high temperature processes such as oxidation for diameter reduction. We ensured identical surface conditions subsequent to diameter reduction with wet-chemical etching and, using DC current-voltage measurements, found the resistance to increase with decreasing diameter. As the diameters were shrunk from a larger diameter to ∼50 nm in diameter, they exhibited a strong non-linear increase of the resistance indicating complete depletion of the cross-section caused by surface charges. The dopant concentration of the nanowires was calculated to be 2.1×10 18 cm -3 and the corresponding surface charge density was around 2.6×10 12 cm -2 .</description><identifier>ISSN: 1944-9399</identifier><identifier>ISBN: 9781424400775</identifier><identifier>ISBN: 1424400775</identifier><identifier>EISSN: 1944-9380</identifier><identifier>DOI: 10.1109/NANO.2006.247679</identifier><language>eng</language><publisher>IEEE</publisher><subject>Chemical vapor deposition ; Current measurement ; Doping ; doping distribution ; Electrical resistance measurement ; impurity distribution ; Nanowires ; Oxidation ; Silicon ; surface depletion ; Surface resistance ; Temperature ; Wet etching</subject><ispartof>2006 Sixth IEEE Conference on Nanotechnology, 2006, Vol.2, p.429-432</ispartof><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1717129$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54555,54920,54932</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1717129$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Kimukin, I.</creatorcontrib><creatorcontrib>Long Do</creatorcontrib><creatorcontrib>Islam, M.S.</creatorcontrib><creatorcontrib>Anwar, A.F.M.</creatorcontrib><title>Determination of Surface Depletion Thickness of p-doped Silicon Nanowires Synthesized Using Metal Catalyzed CVD Process</title><title>2006 Sixth IEEE Conference on Nanotechnology</title><addtitle>NANO</addtitle><description>An in-depth understanding of the distribution and impact of doping in nanowires is crucial for the rational design of future nanowire based devices synthesized using bottom-up techniques. We used a very slow wet chemical etchant for progressive reduction of the diameters of boron-doped, metal-catalyzed silicon nanowires with diverse diameters and lengths. The low temperature process helped avert the dopant segregation which is common in high temperature processes such as oxidation for diameter reduction. We ensured identical surface conditions subsequent to diameter reduction with wet-chemical etching and, using DC current-voltage measurements, found the resistance to increase with decreasing diameter. As the diameters were shrunk from a larger diameter to ∼50 nm in diameter, they exhibited a strong non-linear increase of the resistance indicating complete depletion of the cross-section caused by surface charges. The dopant concentration of the nanowires was calculated to be 2.1×10 18 cm -3 and the corresponding surface charge density was around 2.6×10 12 cm -2 .</description><subject>Chemical vapor deposition</subject><subject>Current measurement</subject><subject>Doping</subject><subject>doping distribution</subject><subject>Electrical resistance measurement</subject><subject>impurity distribution</subject><subject>Nanowires</subject><subject>Oxidation</subject><subject>Silicon</subject><subject>surface depletion</subject><subject>Surface resistance</subject><subject>Temperature</subject><subject>Wet etching</subject><issn>1944-9399</issn><issn>1944-9380</issn><isbn>9781424400775</isbn><isbn>1424400775</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2006</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNo9kFtLw0AQhRcvYKl9F3zZP5C6127msaRahdoKbX0t283ErqZJyEZK_fVuVZyBM3A-OByGkBvOhpwzuJuP54uhYGw0FMqMDJyRHgelEpApOycDMClXQinGjNEX_wzgigxCeGdxlFZSsR45TLDDdu8r2_m6onVBl59tYR3SCTYl_pirnXcfFYZwwk2S1w3mdOlL7yKc26o--BYDXR6rbofBf0W6Dr56o8_Y2ZJmNurx5GavE_rS1i5GXZPLwpYBB3-3T9YP96vsMZktpk_ZeJZ4LgUkKLjaSou5U1poDUrHakYwhFwXznGrtNFFLsHZLeMotyBH8SM65cgdpCD75PY31yPipmn93rbHDTdxBchvqltfuA</recordid><startdate>2006</startdate><enddate>2006</enddate><creator>Kimukin, I.</creator><creator>Long Do</creator><creator>Islam, M.S.</creator><creator>Anwar, A.F.M.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>2006</creationdate><title>Determination of Surface Depletion Thickness of p-doped Silicon Nanowires Synthesized Using Metal Catalyzed CVD Process</title><author>Kimukin, I. ; Long Do ; Islam, M.S. ; Anwar, A.F.M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i1329-e214b3aedc45255945ace720e9d5fcc1a4575fd39cab01e3b936476581e1c9893</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Chemical vapor deposition</topic><topic>Current measurement</topic><topic>Doping</topic><topic>doping distribution</topic><topic>Electrical resistance measurement</topic><topic>impurity distribution</topic><topic>Nanowires</topic><topic>Oxidation</topic><topic>Silicon</topic><topic>surface depletion</topic><topic>Surface resistance</topic><topic>Temperature</topic><topic>Wet etching</topic><toplevel>online_resources</toplevel><creatorcontrib>Kimukin, I.</creatorcontrib><creatorcontrib>Long Do</creatorcontrib><creatorcontrib>Islam, M.S.</creatorcontrib><creatorcontrib>Anwar, A.F.M.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kimukin, I.</au><au>Long Do</au><au>Islam, M.S.</au><au>Anwar, A.F.M.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Determination of Surface Depletion Thickness of p-doped Silicon Nanowires Synthesized Using Metal Catalyzed CVD Process</atitle><btitle>2006 Sixth IEEE Conference on Nanotechnology</btitle><stitle>NANO</stitle><date>2006</date><risdate>2006</risdate><volume>2</volume><spage>429</spage><epage>432</epage><pages>429-432</pages><issn>1944-9399</issn><eissn>1944-9380</eissn><isbn>9781424400775</isbn><isbn>1424400775</isbn><abstract>An in-depth understanding of the distribution and impact of doping in nanowires is crucial for the rational design of future nanowire based devices synthesized using bottom-up techniques. We used a very slow wet chemical etchant for progressive reduction of the diameters of boron-doped, metal-catalyzed silicon nanowires with diverse diameters and lengths. The low temperature process helped avert the dopant segregation which is common in high temperature processes such as oxidation for diameter reduction. We ensured identical surface conditions subsequent to diameter reduction with wet-chemical etching and, using DC current-voltage measurements, found the resistance to increase with decreasing diameter. As the diameters were shrunk from a larger diameter to ∼50 nm in diameter, they exhibited a strong non-linear increase of the resistance indicating complete depletion of the cross-section caused by surface charges. The dopant concentration of the nanowires was calculated to be 2.1×10 18 cm -3 and the corresponding surface charge density was around 2.6×10 12 cm -2 .</abstract><pub>IEEE</pub><doi>10.1109/NANO.2006.247679</doi><tpages>4</tpages><oa>free_for_read</oa></addata></record> |
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subjects | Chemical vapor deposition Current measurement Doping doping distribution Electrical resistance measurement impurity distribution Nanowires Oxidation Silicon surface depletion Surface resistance Temperature Wet etching |
title | Determination of Surface Depletion Thickness of p-doped Silicon Nanowires Synthesized Using Metal Catalyzed CVD Process |
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