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Simulation of electrothermal interactions in power integrated circuits
The authors present SETIPIC, a software package which couples electric and thermal simulations to forecast the electrothermal interactions in the first design steps of power integrated circuits. To give a consistent interface to the designer, SETIPIC is integrated in the EDGE CAD system PICMOST, the...
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| container_end_page | 82 |
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| creator | Hebrard, L. Jacquemod, G. Boutherin, B. Le Helley, M. |
| description | The authors present SETIPIC, a software package which couples electric and thermal simulations to forecast the electrothermal interactions in the first design steps of power integrated circuits. To give a consistent interface to the designer, SETIPIC is integrated in the EDGE CAD system PICMOST, the thermal simulator used by SETIPIC to obtain the thermal distribution on the layout surface in a transient or stationary mode, is also described. It takes into account the chip environment by the connection of different thermal networks, and uses an automatic mesh method to handle the layout configurations. An infrared experimental method is described to characterize the thermal distribution on a chip. This system was used to validate PICMOST. Some simulation results are given.< > |
| doi_str_mv | 10.1109/STHERM.1992.172854 |
| format | conference_proceeding |
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To give a consistent interface to the designer, SETIPIC is integrated in the EDGE CAD system PICMOST, the thermal simulator used by SETIPIC to obtain the thermal distribution on the layout surface in a transient or stationary mode, is also described. It takes into account the chip environment by the connection of different thermal networks, and uses an automatic mesh method to handle the layout configurations. An infrared experimental method is described to characterize the thermal distribution on a chip. This system was used to validate PICMOST. Some simulation results are given.< ></description><identifier>ISBN: 9780780305007</identifier><identifier>ISBN: 0780305000</identifier><identifier>DOI: 10.1109/STHERM.1992.172854</identifier><language>eng</language><publisher>IEEE</publisher><subject>Circuit simulation ; Circuit stability ; Coupling circuits ; Design automation ; Electric variables ; Electrothermal effects ; Packaging ; Power integrated circuits ; Predictive models ; Stability analysis</subject><ispartof>[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 1992, p.76-82</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/172854$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/172854$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Hebrard, L.</creatorcontrib><creatorcontrib>Jacquemod, G.</creatorcontrib><creatorcontrib>Boutherin, B.</creatorcontrib><creatorcontrib>Le Helley, M.</creatorcontrib><title>Simulation of electrothermal interactions in power integrated circuits</title><title>[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium</title><addtitle>STHERM</addtitle><description>The authors present SETIPIC, a software package which couples electric and thermal simulations to forecast the electrothermal interactions in the first design steps of power integrated circuits. To give a consistent interface to the designer, SETIPIC is integrated in the EDGE CAD system PICMOST, the thermal simulator used by SETIPIC to obtain the thermal distribution on the layout surface in a transient or stationary mode, is also described. It takes into account the chip environment by the connection of different thermal networks, and uses an automatic mesh method to handle the layout configurations. An infrared experimental method is described to characterize the thermal distribution on a chip. This system was used to validate PICMOST. Some simulation results are given.< ></description><subject>Circuit simulation</subject><subject>Circuit stability</subject><subject>Coupling circuits</subject><subject>Design automation</subject><subject>Electric variables</subject><subject>Electrothermal effects</subject><subject>Packaging</subject><subject>Power integrated circuits</subject><subject>Predictive models</subject><subject>Stability analysis</subject><isbn>9780780305007</isbn><isbn>0780305000</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1992</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNotj91KAzEQhQMiKHVfoFd5gV3z_3MppbVCRbD1uqTJRCO73ZJNEd_eaB0GDucbOJxBaE5JRymx99vdevn63FFrWUc1M1JcocZqQ-pyIgnRN6iZpk9SR0iqlL5Fq20azr0raTziMWLowZc8lg_Ig-txOhbIzv9ep2rwafyC_EffsysQsE_Zn1OZ7tB1dP0Ezb_O0NtquVus283L49PiYdOmWqi0TjgLUmhNdRBaHIKRMnoI3HMVCWecGxccmBAqtzEyYKr2NspLSfiB8RmaX3ITAOxPOQ0uf-8vz_Ifh0BL5A</recordid><startdate>1992</startdate><enddate>1992</enddate><creator>Hebrard, L.</creator><creator>Jacquemod, G.</creator><creator>Boutherin, B.</creator><creator>Le Helley, M.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>1992</creationdate><title>Simulation of electrothermal interactions in power integrated circuits</title><author>Hebrard, L. ; Jacquemod, G. ; Boutherin, B. ; Le Helley, M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i172t-a4a9e547717d474bd855fced3c36f032338adae8dd55f9ff2e2650086c5503b23</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1992</creationdate><topic>Circuit simulation</topic><topic>Circuit stability</topic><topic>Coupling circuits</topic><topic>Design automation</topic><topic>Electric variables</topic><topic>Electrothermal effects</topic><topic>Packaging</topic><topic>Power integrated circuits</topic><topic>Predictive models</topic><topic>Stability analysis</topic><toplevel>online_resources</toplevel><creatorcontrib>Hebrard, L.</creatorcontrib><creatorcontrib>Jacquemod, G.</creatorcontrib><creatorcontrib>Boutherin, B.</creatorcontrib><creatorcontrib>Le Helley, M.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore (Online service)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hebrard, L.</au><au>Jacquemod, G.</au><au>Boutherin, B.</au><au>Le Helley, M.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Simulation of electrothermal interactions in power integrated circuits</atitle><btitle>[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium</btitle><stitle>STHERM</stitle><date>1992</date><risdate>1992</risdate><spage>76</spage><epage>82</epage><pages>76-82</pages><isbn>9780780305007</isbn><isbn>0780305000</isbn><abstract>The authors present SETIPIC, a software package which couples electric and thermal simulations to forecast the electrothermal interactions in the first design steps of power integrated circuits. To give a consistent interface to the designer, SETIPIC is integrated in the EDGE CAD system PICMOST, the thermal simulator used by SETIPIC to obtain the thermal distribution on the layout surface in a transient or stationary mode, is also described. It takes into account the chip environment by the connection of different thermal networks, and uses an automatic mesh method to handle the layout configurations. An infrared experimental method is described to characterize the thermal distribution on a chip. This system was used to validate PICMOST. Some simulation results are given.< ></abstract><pub>IEEE</pub><doi>10.1109/STHERM.1992.172854</doi><tpages>7</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISBN: 9780780305007 |
| ispartof | [1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 1992, p.76-82 |
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| language | eng |
| recordid | cdi_ieee_primary_172854 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Circuit simulation Circuit stability Coupling circuits Design automation Electric variables Electrothermal effects Packaging Power integrated circuits Predictive models Stability analysis |
| title | Simulation of electrothermal interactions in power integrated circuits |
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