Compact liquid cooling system for small, moveable electronic equipment

A compact liquid cooling system has been evaluated in a benchmark of self-contained heat exchanger units that fit within small movable electronic equipment, such as PCs and workstations. The compact cooling system connects to a multichip module package via a pair of flexible stainless steel hoses. T...

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Bibliographic Details
Main Authors: Lee, T.Y.T., Andrews, J., Chow, P., Saums, D.
Format: Conference Proceeding
Language:English
Subjects:
Electronic equipment
Electronics cooling
Electronics packaging
Liquid cooling
Multichip modules
Packaging machines
Personal communication networks
Temperature
Thermal resistance
Workstations
Online Access:Request full text
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Summary:A compact liquid cooling system has been evaluated in a benchmark of self-contained heat exchanger units that fit within small movable electronic equipment, such as PCs and workstations. The compact cooling system connects to a multichip module package via a pair of flexible stainless steel hoses. The system contains a fluid expansion chamber, a liquid-to-air heat exchanger core, a fan, and a pump and can operate entirely sealed. Pressures, package power dissipation, flow rate, and temperatures were recorded. The coolant liquid chosen for use in this system was 3M Fluorinert type FC-72, a chemically inert dielectric liquid. The 5.5 liter prototype system delivers 1.1 liter/min of FC-72. Test results showed the unit can remove up to 274 W of power dissipated with a 52 degrees C temperature difference between inlet liquid and air with a thermal resistance of 0.19 degrees C/W. Design improvements for a second generation system are proposed.< >
DOI:10.1109/STHERM.1992.172864