Millimeter-wave packaging

The authors reviewed the state of the art in millimeter-wave packaging and analyzed its potentials and limitations. Based on the analysis of the requirements and technology development, the following trends can be expected for millimeter-wave packages: (1) packaging at higher levels of integration-t...

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Bibliographic Details
Main Authors: Kuno, H.J., Midford, T.A.
Format: Conference Proceeding
Language:English
Subjects:
Aircraft
Degradation
Electronics packaging
Heat sinks
Integrated circuit packaging
Millimeter wave integrated circuits
Millimeter wave technology
Packaging machines
Phased arrays
Radio frequency
Online Access:Request full text
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Summary:The authors reviewed the state of the art in millimeter-wave packaging and analyzed its potentials and limitations. Based on the analysis of the requirements and technology development, the following trends can be expected for millimeter-wave packages: (1) packaging at higher levels of integration-the advent of millimeter-wave multichip packages; (2) the substantially increased use of electromagnetic simulation design tools; (3) the introduction of new materials and processes, for example AlN and cofired ceramic techniques; (4) the integration of a considerably higher complexity and multiplicity of electronic functions within the package envelope; and (5) a substantial reduction in the size, weight, and cost of millimeter-wave packages.< >
ISSN:0149-645X
2576-7216
DOI:10.1109/MWSYM.1992.188299