Robust solder joint attachment of coaxial cable leads to piezoelectric ceramic electrodes

A technique was developed for the solder attachment of coaxial cable leads to silver-bearing thick-film electrodes on piezoelectric ceramics. Soldering the cable leads directly to the thick film caused bonds with low mechanical strength due to poor solder joint geometry. A barrier coating of 1.5 mu...

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Bibliographic Details
Published in:IEEE transactions on ultrasonics, ferroelectrics, and frequency control ferroelectrics, and frequency control, 1993-09, Vol.40 (5), p.544-550
Main Author: Vianco, P.T.
Format: Article
Language:English
Subjects:
Applied sciences
Ceramics
Coatings
Coaxial cables
Electrodes
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Geometry
Lead
Mechanical cables
Robustness
Soldering
Thick films
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Summary:A technique was developed for the solder attachment of coaxial cable leads to silver-bearing thick-film electrodes on piezoelectric ceramics. Soldering the cable leads directly to the thick film caused bonds with low mechanical strength due to poor solder joint geometry. A barrier coating of 1.5 mu m Cu/1.5 mu m Ni/1.0 mu m Sn deposited on the thick-film layer improved the strength of the solder joints by eliminating the adsorption of Ag from the thick film, which was responsible for the improper solder joint geometry. The procedure does not require special preparation of the electrode surface and is cost effective due to the use of nonprecious metal films and the batch processing capabilities of the electron beam deposition technique.< >
ISSN:0885-3010
1525-8955
DOI:10.1109/58.238108