A laser-programmable multichip module on silicon

A laser-programmable substrate for multichip modules comprises a silicon substrate with a dense, predefined array of pads, tracks and links. A pattern of wiring connecting some of the pads is formed with a laser. Integrated circuit chips are mounted on the substrate, and the chip pads are wire-bonde...

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Bibliographic Details
Main Authors: Berger, R., Frankel, R.S., Raffel, J.I., Woodward, C.E., Wyatt, P.W.
Format: Conference Proceeding
Language:English
Subjects:
Circuits
Joining processes
Laboratories
Laser beam cutting
Lifting equipment
Multichip modules
Optical pulses
Power lasers
Silicon
Wiring
Online Access:Request full text
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Summary:A laser-programmable substrate for multichip modules comprises a silicon substrate with a dense, predefined array of pads, tracks and links. A pattern of wiring connecting some of the pads is formed with a laser. Integrated circuit chips are mounted on the substrate, and the chip pads are wire-bonded to the substrate pads. East-west tracks are on the second level of metal, and north-south tracks on the first level. Power, ground, and signals share the tracks on the two metal layers. There is an array of 258-by-258 pads on a 200- mu m pitch, and there are three signal tracks, one power track, and one ground track between any two adjacent pads. Links consist of a silicon nitride layer sandwiched between the two metal layers. When a laser pulse of the correct power and duration is directed to the link region, the metal and nitride fuse to form a conductive vertical path, with a resistance typically two ohms.< >
DOI:10.1109/ICWSI.1993.255276