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An asymmetric sidewall process for high performance LDD MOSFET's
An asymmetric LDD sidewall spacer technology is presented which gives a high drivability of LDD MOSFET without sacrificing hot carrier immunity. The asymmetric spacer is fabricated by using a selective oxide deposition technique. The process implemented in a CMOS fabrication sequence requires no add...
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Published in: | IEEE transactions on electron devices 1994-02, Vol.41 (2), p.186-190 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | An asymmetric LDD sidewall spacer technology is presented which gives a high drivability of LDD MOSFET without sacrificing hot carrier immunity. The asymmetric spacer is fabricated by using a selective oxide deposition technique. The process implemented in a CMOS fabrication sequence requires no additional masking step. The fact that no reliability problems are introduced in the transistor characteristics by the selective oxide deposition process is also examined.< > |
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ISSN: | 0018-9383 1557-9646 |
DOI: | 10.1109/16.277381 |