Analysis of color variation in bonded SOI wafers

In this paper, we analyze why SOI wafers appear as they do to the naked eye. We show how a thickness variation as small as ten Angstroms can cause a readily discernible color change, and why this optical effect is much stronger in a thinned SOI wafer than in an oxide-coated wafer or in thick SOI waf...

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Bibliographic Details
Main Authors: Clapis, P.J., Ledger, A.M., Daniell, K.E.
Format: Conference Proceeding
Language:English
Subjects:
Color
Optical device fabrication
Optical films
Optical sensors
Plasma devices
Plasma materials processing
Plasma properties
Reflectivity
Silicon
Wafer bonding
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Summary:In this paper, we analyze why SOI wafers appear as they do to the naked eye. We show how a thickness variation as small as ten Angstroms can cause a readily discernible color change, and why this optical effect is much stronger in a thinned SOI wafer than in an oxide-coated wafer or in thick SOI wafers.< >
DOI:10.1109/SOI.1993.344589