Loading…
Area array interconnection with Cu-PI thin films on a multi-layer glass-ceramic substrate
The microelectronic packaging technology for the SS-1 supercomputer utilizes an interposer to interconnect integrated circuit devices. Area array solder bump interconnection has been used successfully in attaching both chips to the interposer, a Cu-PI thin film/multi-layer glass-ceramic substrate, a...
Saved in:
Main Authors: | , , , , , |
---|---|
Format: | Conference Proceeding |
Language: | English |
Subjects: | |
Online Access: | Request full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | The microelectronic packaging technology for the SS-1 supercomputer utilizes an interposer to interconnect integrated circuit devices. Area array solder bump interconnection has been used successfully in attaching both chips to the interposer, a Cu-PI thin film/multi-layer glass-ceramic substrate, and attaching this interposer to a larger Cu-PI thin film/glass-ceramic substrate. This highly reliable chip interconnection technology has been extended to interposer to substrate interconnection, with commensurate increases in both the interconnection density and total number of I/O connections per module. In this paper, key elements of both the flip-chip and interposer join and replace processes are reviewed. Additionally, optimization of the thin film metallurgy and join/replace parameters necessary to achieve high reliability are presented.< > |
---|---|
DOI: | 10.1109/ECTC.1993.346709 |